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张硕, 王耕籍, 尹金良, 等. 基于串扰电压峰值的IGBT模块键合线老化监测方法[J]. 太阳能学报, 2025,46(6):314-320.
张硕, 王耕籍, 尹金良, et al. 基于串扰电压峰值的IGBT模块键合线老化监测方法[J]. 2025, 46(6): 314-320.
张硕, 王耕籍, 尹金良, 等. 基于串扰电压峰值的IGBT模块键合线老化监测方法[J]. 太阳能学报, 2025,46(6):314-320. DOI: doi:10.19912/j.0254-0096.tynxb.2024-0205.
张硕, 王耕籍, 尹金良, et al. 基于串扰电压峰值的IGBT模块键合线老化监测方法[J]. 2025, 46(6): 314-320. DOI: doi:10.19912/j.0254-0096.tynxb.2024-0205.
针对IGBT模块键合线老化监测问题
该文提出一种基于串扰电压峰值的监测方法
该方法以IGBT模块构成的半桥电路为研究对象
基于IGBT模块的开关模态
对键合线脱落机理及串扰电压产生过程详细分析
并对串扰电压分段建模;推导出键合线脱落对串扰电压形成各个阶段的影响
进而通过对串扰电压峰值的测量实现对IGBT模块键合线健康状况的实时监测;仿真和实验结果验证该方法的可行性和准确性。
To address the issue of bond wires aging in IGBT
a monitoring method based on the crosstalk vdtage peak is proposed. The half bridge circuit composed of IGBT modules is taken as the research object by this method. Based on the switching mode of IGBT modules
the mechanism of bond wire detachment and the process of crosstalk voltage generation are analyzed in detail
and the crosstalk voltage is segmented and modeled. The impact of wire detachment on the formation of crosstalk voltage at various stages has been derived
and real-time monitoring of the health status of IGBT module bond wires is achieved by measuring the peak value of crosstalk voltage. The simulation and experimental results have verified the feasibility and accuracy of this method.
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