LU Yunfeng, JIN Ye, SUN Qingfeng, et al. Analysis of SF leakage caused by GIS displacement under high temperature[J]. Ningxia Electric Power, 2026, (3).
LU Yunfeng, JIN Ye, SUN Qingfeng, et al. Analysis of SF leakage caused by GIS displacement under high temperature[J]. Ningxia Electric Power, 2026, (3).DOI: 10.3969/j.issn.1672-3643.2026.03.007.
To address the recurrent issue of SF6 leakage caused by the cracking of epoxy resin terminal plates in gas-insulated switchgear(GIS)current transformers during high-temperature periods at a certain location
this paper analyzes the evolution of GIS shell displacement during sustained high temperatures
using a terminal plate cracking failure case as an example. Through technical means such as macroscopic inspection
spacing measurement
CT scanning
density measurement
and specific heat analysis
combined with influencing factors including assembly flatness
sustained high temperatures
and material properties
the causes of the failure are investigated from multiple perspectives. Testing on the failed samples shows that there is no abnormality in the terminal plate material quality. The failure mode involves cracks propagating symmetrically downward from the upper-left position-where the stress is most complex after tightening-under bending stress. The main cause of the failure is the uneven installation of the terminal plate inside the junction box
which subjects it to prolonged shear stress. Sustained high temperatures cause axial displacement and end rotation of the GIS shell. During heating
the displacement force converges at the top of the junction box outer shell
resulting in excessive pressure and significant stress concentration. In addition
the outdoor high-temperature environment degrades the polymerization rate of the epoxy resin molecular chain
gradually increasing brittleness. When local stress exceeds the allowable stress