新型超薄环路热管的实验研究

张寒宇; 刘志春

doi:10.3969/j.issn.1008-0198.2025.04.016

欢迎来到能源电力期刊网！

English Version 读者登录期刊登录

您当前的位置：

首页 >

文章列表页 >

新型超薄环路热管的实验研究

多能互补与储能 | 更新时间：2025-12-08

- 新型超薄环路热管的实验研究
- Experimental Study of a New Ultra-Thin Loop Heat Pipe
- 湖南电力 2025年45卷第4期页码：112-118
- 作者机构：
  
  华中科技大学热科学与工程实验室,湖北,武汉,430074
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.1008-0198.2025.04.016
  中图分类号： TK172.4
- 网络出版：2025-09-05，
  
  纸质出版：2025-09-05
- 稿件说明：
移动端阅览
张寒宇, 刘志春. 新型超薄环路热管的实验研究[J]. 湖南电力, 2025, 45(4): 112-118.

ZHANG Hanyu, LIU Zhichun. Experimental Study of a New Ultra-Thin Loop Heat Pipe[J]. 2025, 45(4): 112-118.
张寒宇, 刘志春. 新型超薄环路热管的实验研究[J]. 湖南电力, 2025, 45(4): 112-118. DOI： 10.3969/j.issn.1008-0198.2025.04.016.

ZHANG Hanyu, LIU Zhichun. Experimental Study of a New Ultra-Thin Loop Heat Pipe[J]. 2025, 45(4): 112-118. DOI： 10.3969/j.issn.1008-0198.2025.04.016.

摘要

目前移动电子设备日益增长的高性能与轻薄化需求

对环路热管（loop heat pipe

LHP）的散热能力及厚度提出了更高要求。面向移动电子器件热管理需求

设计并制备0.71 mm厚度的新型超薄平板式LHP。在充灌率38%、无重力倾角条件下

通过实验测试系统在不同热负荷与风冷条件下的热性能。结果表明系统最大传热量达16 W

且在4~16 W热输入范围内均能稳定启动并呈现良好热响应特性。环路热阻随热输入增大而升高

最低值为1.36 ℃/W。研究表明

所设计的超薄LHP可满足峰值功耗16 W的芯片散热需求

在移动电子器件热管理领域具有显著应用潜力。

Abstract

The increasing demand for high performance and thinness of mobile electronic devices has put forward higher requirements on the heat dissipation capability and thickness of loop heat pipes (LHPs). In order to meet the thermal management requirements of mobile electronic devices

a new type of ultra-thin flat-plate LHP with a thickness of 0.71 mm is designed and prepared

and the thermal performance of the system is experimentally tested under different thermal loads and air-cooling conditions with a filling rate of 38% and no gravitational inclination. The results show that the maximum heat transfer of the system reaches 16 W

and the system can be stably activated and shows good thermal response characteristics in the range of 4~16 W thermal input. The thermal resistance of the loop increases with the increase of thermal input

and the lowest value is 1.36 ℃/W. The study shows that the designed ultra-thin LHP can meet the heat dissipation demand of the chip with a peak power consumption of 16 W

and it has a significant potential for the application in the field of thermal management of mobile electronic devices.

关键词

Keywords

references

TAVAKKOLI F,EBRAHIMI S,WANG S J.Analysis of critical thermal issues in 3D integrated circuits[J]. International Journal of Heat and Mass Transfer,2016,97:337-352.

过增元. 国际传热研究前沿—微细尺度传热[J]. 力学进展,2000,30(1):1-6.

S.Younes.传热学:电力电子器件热管理[M]. 北京:机械工业出版社.

TANG H,TANG Y,WAN Z P,et al.Review of applications and developments of ultra-thin micro heat pipes for electronic cooling[J]. Applied Energy,2018,223:383-400.

唐永乐. 基于丝网型吸液芯的超薄热管传热特性研究[D]. 广州:华南理工大学,2020.

洪思慧. 超薄平板回路式热管的热传输性能研究[D] .广州:华南理工大学,2018.

HONG S H,WANG S F,ZHANG L.Effect of groove configuration on two-phase flow instability for Ultra-Thin Looped Heat Pipes in thermal management system[J]. International Journal of Thermal Sciences,2017,121:369-380.

DOMICIANO K G,KRAMBECK L.Thin diffusion bonded flat loop heat pipes for electronics:Fabrication,modelling and testing[J]. Energy Conversion and Management,2022,255:115329.

SHIOGA T,MIZUNO Y.Micro loop heat pipe for mobile electronics applications[C]//2015 31st Thermal Measurement,Modeling & Management Symposium(SEMI-THERM).San Jose,CA,USA.IEEE,2015.

GUO H,JI X,XU J.Research and development of loop heat pipe:a review[J]. Frontiers in Heat and Mass Transfer,2020,14:1-16.

SHIOGA T,MIZUNO Y,NAGANO H.Operating characteristics of a new ultra-thin loop heat pipe[J].International Journal of Heat and Mass Transfer, 2020,151:119436.

SHIOGA T,ABE T,NAGANO H.Submillimeter-thick loop heat pipes fabricated using two-layer copper sheets for cooling electronic applications[J]. Applied Thermal Engineering,2020,181:116018.

UENO A,TOMITA S,NAGANO H.Experimental investigation on a thin-loop heat pipe with new evaporator structure[J]. ASME. J. Heat Transfer, 2021,143(6):061901.

CHEN A Q,JIANG F,DONG J J.Design,fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling[J]. Applied Thermal Engineering,2022,200:117683.

MIZUTANI T,WATANABE N,ASO S,et al.Experimental and analytical investigation of a 0.3-mm-thick loop heat pipe for 10 W-class heat dissipation[J].International Journal of Heat and Mass Transfer,2022,193:122950.

ZHOU G H,LI J,JIA Z Z.Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module[J]. Applied Energy,2019,239:859-875.

陈子昂. 硅基微型环路热管的可视化与传热实验研究[D]. 济南:山东大学,2019.

浏览量

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

暂无数据