1. 华中科技大学能源与动力工程学院,湖北,武汉,430074
2. 东风汽车集团股份有限公司研发总院,湖北,武汉,430056
网络出版:2025-07-02,
纸质出版:2025
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刘亦文, 崔盼, 刘伟, 刘志春, 崔海川. 矩形肋片歧管微通道热沉性能研究与优化设计[J]. 湖南电力, 2025, 45(3): 1-8.
LiU Yiwen, CUi Pan, LiU Wei, et al. Performance Study and Optimization Design of Manifold Microchannel Heat Sink With Rectangular Ribs[J]. 2025, 45(3): 1-8.
刘亦文, 崔盼, 刘伟, 刘志春, 崔海川. 矩形肋片歧管微通道热沉性能研究与优化设计[J]. 湖南电力, 2025, 45(3): 1-8. DOI: 10.3969/j.issn.1008-0198.2025.03.001.
LiU Yiwen, CUi Pan, LiU Wei, et al. Performance Study and Optimization Design of Manifold Microchannel Heat Sink With Rectangular Ribs[J]. 2025, 45(3): 1-8. DOI: 10.3969/j.issn.1008-0198.2025.03.001.
为提升歧管微通道热沉的综合性能
提出一种新型矩形肋片歧管微通道热沉。首先通过三维模拟研究矩形肋片排布、微通道宽度、高度及肋片宽度与微通道宽度的比值对热工水力性能的影响。然后采用人工神经网络和多目标遗传算法对结构参数进行优化
最后使用TOPSiS决策算法从Pareto前沿中选出综合性能最好的参数组合。优化后
与原热沉相比
在6 m/s的入口流速下
加热面最高温度降低了6.4 K
平均换热系数提高了46.3%
总压降降低了1.85 kPa。结果表明
避开入口歧管的射流孔和出口歧管的出流孔的矩形肋片热沉具备优异的综合性能。
To enhance the comprehensive performance of the manifold microchannel heat sink (MMCHS)
a new manifold microchannel heat sink with rectangular ribs (MMCHS-RR) is proposed. Firstly
the three-dimensional numerical simulations are employed to investigate the effects of the arrangement of rectangular ribs
microchannel width
microchannel height
and the ratio of rectangular rib width to microchannel width on the thermal-hydraulic performance. Then the artificial neural network and a multi-objective genetic algorithm are used to optimize the structural parameters. Finally
the TOPSIS decision-making algorithm is applied to select the parameter combination with the best comprehensive performance from the Pareto front. After optimization
compared with the initial heat sink
the maximum temperature on the heated surface is reduced by 6.4 K
the average heat transfer coefficient is increased by 46.3%
and the total pressure drop is reduced by 1.85 kPa at an inlet flow rate of 6 m/s. The research results indicate that the heat sink with rectangular ribs arranged to bypass the jet holes of the inlet manifold and the outflow holes of the outlet manifold exhibits superior comprehensive performance.
SOHEL MURSHED S M,NIETO DE CASTRO C A. A critical review of traditional and emerging techniques and fluids for electronics cooling[J]. Renewable and Sustainable Energy Reviews,2017,78:821-833.
HE Z Q,YAN Y F,ZHANG Z E.Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks:a review[J]. Energy,2021,216:119223.
YU Z Q,LI M T,CAO B Y.A comprehensive review on microchannel heat sinks for electronics cooling[J]. International Journal of Extreme Manufacturing,2024,6(2):022005.
LI S,ZHANG H N,CHENG J P,et al.A state-of-the-art overview on the developing trend of heat transfer enhancement by single-phase flow at micro scale[J]. International Journal of Heat and Mass Transfer,2019,143:118476.
TUCKERMAN D B,PEASE R F W. High-performance heat sinking for VLSI[J]. IEEE Electron Device Letters,1981,2(5):126-129.
HARPOLE G M,ENINGER J E.Micro-channel heatexchanger optimization[C]//1991 Proceedings,Seventh IEEE Semiconductor Thermal Measurement and Management Symposium. Phoenix,AZ,USA. IEEE,1991:59-63.
KIM Y H,CHUN W C,KIM J T,et al.Forced air cooling by using manifold microchannel heat sinks[J]. KSME International Journal,1998,12(4):709-718.
YANG X,LIN K B,ZHANG D X,et al.A novel manifold dual-microchannel flow field structure with high-performance heat dissipation[J]. Micromachines,2022,13(9):1420.
QIU Y,WANG H G,CARTER J,et al.Experimental investigation of heat transfer and pressure drop in copper manifold microchannel heat sinks[J]. Applied Thermal Engineering,2024,255:124024.
VAN ERP R, SOLEIMANZADEH R, NELA L, et al.Co-designing electronics with microfluidics for more sustainable cooling[J]. Nature,2020,585(7824):211-216.
CHEN C W,WANG X Y,YUAN B Q,et al.Investigation of flow and heat transfer performance of the manifold microchannel with different manifold arrangements[J]. Case Studies in Thermal Engineering,2022,34:102073.
LUO Y,ZHANG J Z,LI W.A comparative numerical study on two-phase boiling fluid flow and heat transfer in the microchannel heat sink with different manifold arrangements[J]. International Journal of Heat and Mass Transfer,2020,156:119864.
TANG K,LIN G P,GUO Y D,et al.Simulation and optimization of thermal performance in diverging/converging manifold microchannel heat sink[J]. International Journal of Heat and Mass Transfer,2023,200:123495.
YAO X L,SHI Q L,LIU Q,et al.An investigation on application potentiality of microstructure heat sinks with different flow topological morphology[J]. Science China Technological Sciences,2022,65(12):2895-2909.
GILMORE N,TIMCHENKO V,MENICTAS C.Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop[J]. International Journal of Heat and Mass Transfer,2020,163:120395.
WEI X G,FENG Y,YAN T S,et al.Optimization of manifold microchannel heat sink based on design of experiment method[J]. ASME Journal of Heat and Mass Transfer,2024,146(8):081701.
CUI H C,SHI C Y,YU M J,et al.Optimal parameter design of a slot jet impingement/microchannel heat sink base on multi-objective optimization algorithm[J]. Applied Thermal Engineering,2023,227:120452.
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