Ren Qing-lei, Wei Xin, Xie Xiao-zhu, et al. A Survey of Grinding Wheel for Precision Grinding of Silicon Wafer[J]. 2016, 33(2): 19-23.DOI: 10.3969/j.issn.1007-7162.2016.02.004.
The grinding wheel is a key processing tool in the precision grinding of silicon wafer. The domestic and foreign research on the grinding wheel for wafer precision grinding is summarized and analyzed
proposing that research on wheel preparation technology need further theoretical support. The research on the wheel wear and evaluation method of observation should firstly establish the wheel model
and analyze the wheel wear mechanism of the different grinding stages according to the material properties of silicon wafer
and finally validate wear process by grinding experiments and using the preferred wheel observation and evaluation method.