Yi Qun-sheng, Zhang Yun, Luo Bing. Improved Phase Unwrapping Method Using 2D Information in PMP 3D Measurement[J]. 2013, 30(2): 74-78.DOI: 10.3969/j.issn.1007-7162.2013.02.014.
In SMT solder paste deposit 3D measurement based on Phase Measurement Profilometry(PMP)
shadow
noise and holes made the conventional phase unwrapping method unable to meet requirement. Considering practical engineering conditions
the phase unwrapping method was improved with 2D image information: the basic principle method was applied to smooth areas while the quality-guided unwrapping and least-square methods were employed in shadow areas
border areas and special solder for phase unwrapping respectively. Experimental results show that the proposed method can ensure the correct and quick unwrapping of desired phases.