Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status

Yao Chang; Yu Zhou; Ankang Zhu; Haoze Luo; Wuhua Li; Chushan Li; Francesco Iannuzzo; Xiangning He

doi:10.17775/CSEEJPES.2021.06660

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Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status

Regular Papers | 更新时间：2026-10-15

- Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status
- Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status
- 中国电机工程学会电力与能源系统学报(英文) 2025年11卷第1期页码：424-439
- 作者机构：
  
  1. College of Electrical Engineering, Zhejiang University,Hangzhou,China
  2. Zhejiang University–University of Illinois at Urbana-Champaign Institute, Zhejiang University, Haining,China
  3. Department of Energy Technology, Aalborg University, Aalborg,Denmark
- 作者简介：
- 基金信息：
- DOI：10.17775/CSEEJPES.2021.06660
  中图分类号：
- 纸质出版：2025-01-01
- 稿件说明：
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Yao Chang, Yu Zhou, Ankang Zhu, 等. Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status[J]. 中国电机工程学会电力与能源系统学报(英文), 2025,11(1):424-439.

Yao Chang, Yu Zhou, Ankang Zhu, et al. Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status[J]. CSEE Journal of Power and Energy Systems, 2025, 11(1): 424-439.
Yao Chang, Yu Zhou, Ankang Zhu, 等. Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status[J]. 中国电机工程学会电力与能源系统学报(英文), 2025,11(1):424-439. DOI： 10.17775/CSEEJPES.2021.06660.

Yao Chang, Yu Zhou, Ankang Zhu, et al. Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status[J]. CSEE Journal of Power and Energy Systems, 2025, 11(1): 424-439. DOI： 10.17775/CSEEJPES.2021.06660.

摘要

Abstract

The press-pack power module with multi-chip layout has drawn increasing attention from industry and academia with its thermal analysis becoming an essential issue. However

the pressure-dependent thermal variables

such as thermal contact resistance and thermal coupling resistance

are often neglected. In this paper

a pressure-dependent thermal network model is developed to characterize the thermal performance and mechanical status of press-pack power modules. By including the thermal contact resistance and thermal coupling resistance as the function of pressure

the proposed model ensures a more precise thermo-mechanical evaluation inside the press-pack power module. The influence of pressure on self-heating effects and thermal coupling effects of power modules is studied using the knowledge of elastic mechanics. A press-pack prototype with variable pressure loads is assembled. Then

thermal experiments under different pressures on chips are conducted and the pressure-variable temperature responses of the thermal network are measured. Consequently

the feasibility of the proposed thermal network model is validated. A cost-effective prognostic method on the mechanical status of press-pack power module is also achieved.

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references

15. ( 2020, Jan. 11 ). Insulated Gate Bi-Polar Transistor Type T2960BB45E . [Online ] . Available: https://www.littelfuse.com/∼/medialelectronics/datasheets/discrete_igbts/littelfuse_discrete_igbts_high_power_igbts_t2960bb45e_datasheet.pdf.pdf.

19. Mechanical clamping of press-pack high power semiconductors , [Online ] . Available: https://search.abb.com/library/Download.aspx?DocumentID=5SYA2036LanguageCode=enDocumentPartId=Action=Launch#:~:text=Press%2Dpack%20high%20power%20semiconductors%20should%20be%20fully%20clamped%20prior.high%20power%20semiconductors%20during%20assembly.

27. David Roylance, Stress-strain curves . [Online ] . Available: https://web.mit.edu/course/3/3.111www/modules/ss.pdf.

28. Fundamentals. ( 2016, Apr. 22 ) Types of Copper and Properties . [Online ] . Available: https://www.copper.org/applications/architecture/arch_dhb/technical-discussion/fundamentals/intro.html.

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