1. 西安工程大学电子信息学院,西安,710048
2. 西安市电气设备互联感知与智能诊断重点实验室,西安,710048
3. 西安建筑科技大学环境与市政工程学院,西安,710055
4. 电子科技大学长三角研究院(湖州),湖州,313000
5. 西安工程大学电子信息学院,西安,710048
收稿:2026-09-30,
纸质出版:2026
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乌江, 王晓敏, 刘佳怡, 等. 考虑电-热协同效应的MXene/PI复合薄膜耐电晕性能[J]. 高电压技术, 2026,52(9):4396-4406.
WU Jiang, WANG Xiaomin, LIU Jiayi, et al. 考虑电-热协同效应的MXene/PI复合薄膜耐电晕性能[J]. 2026, 52(9): 4396-4406.
乌江, 王晓敏, 刘佳怡, 等. 考虑电-热协同效应的MXene/PI复合薄膜耐电晕性能[J]. 高电压技术, 2026,52(9):4396-4406. DOI: 10.13336/j.1003-6520.hve.20250887.
WU Jiang, WANG Xiaomin, LIU Jiayi, et al. 考虑电-热协同效应的MXene/PI复合薄膜耐电晕性能[J]. 2026, 52(9): 4396-4406. DOI: 10.13336/j.1003-6520.hve.20250887.
聚酰亚胺(polyimide
PI)因其优异的热稳定性和绝缘性能被广泛用于变频电机绝缘,但其在高频电压下的耐电晕性能较差,严重影响设备寿命。该研究选取一种具有高热导率与高电导率的MXene二维材料,采用原位聚合法制备了0%、1%、2%、5%掺杂质量分数的MXene/PI复合薄膜,对未掺杂与不同掺杂比例的复合薄膜进行了表面官能团、元素分布以及微观形貌表征,再通过陷阱分布特性、表面电导率、热导率以及耐电晕特性的测量。实验结果表明,随着MXene掺杂含量的增加,MXene/PI复合薄膜的耐电晕时间逐渐增加,5%MXene/PI复合薄膜的平均耐电晕时间相比于PI 提升了443.75%,达到142 min。综合分析了复合薄膜的耐电晕性能中的电学与热学作用因素,随着MXene含量的增加,深陷阱密度显著减小,而深陷阱能级和浅陷阱分布整体变化较小,同时复合薄膜的表面电导率逐渐增加。分析认为,MXene在薄膜内相互搭接形成导电网络,促进了表面电荷的消散,抑制了电场畸变。而对于含有MXene的复合薄膜,其热导率和散热特性均明显高于PI,减小了长时间电晕下热积累对薄膜分子结构的破坏。对于复合薄膜的电晕放电现象,在短时间内的主导机制为高能带电粒子的撞击与表面电荷积聚所形成的快速破坏过程,而随着耐电晕时长的增加,电晕放电逐渐转为电-热协同破坏作用。
Polyimide (PI) is widely used in the insulation of variable frequency motors due to its excellent thermal stability and insulation performance. However
its poor corona resistance under high-frequency voltage significantly affects the lifespan of equipment. In this study
a two-dimensional MXene material with high thermal conductivity and high electrical conductivity were selected
and MXene/PI composite films with 0%
1%
2%
and 5% doping mass percentages were prepared by in-situ polymerization. Surface functional groups
elemental distribution
and microscopic morphology of undoped and different doping ratio composite films were characterized
followed by measurements of trap distribution characteristics
surface conductivity
thermal conductivity
and corona resistance. The experimental results showed that
with the increase of MXene doping content
the corona resistance time of MXene/PI composite film gradually increased. The average corona resistance time of 5% MXene/PI composite film increased by 443.75% compared to PI
reaching 142 minutes. A comprehensive analysis was conducted on the electrical and thermal factors affecting the corona resistance of composite films. With the increase of MXene content
the density of deep traps significantly decreases
while the overall changes in deep trap energy levels and shallow trap distribution are relatively small. At the same time
the surface conductivity of the composite film gradually increases. Analysis suggests that MXene overlaps with each other within the thin film to form a conductive network
promoting the dissipation of surface charges and suppressing electric field distortion. For composite films containing MXene
their thermal conductivity and heat dissipation characteristics are significantly higher than those of PI
reducing the damage to the molecular structure of the film caused by long-term corona heat accumulation. For the corona discharge phenomenon of composite films
the dominant mechanism in a short period of time is the rapid destruction process formed by the impact of high-energy charged particles and the accumulation of surface charges. As the corona resistance time increases
the corona discharge gradually turns into an electric thermal synergistic destruction effect.
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