Epoxy composite insulating materials are extensively used in high-voltage power transmission

electronic packaging

and various other fields due to the excellent structural stability

electrical insulation properties

and process adaptability. However

interface problems

such as inadequate bonding

excessive thermal resistance

and charge accumulation at the interface

significantly constrain the comprehensive performance of the composites

limiting their reliability under complex and demanding working conditions. This paper systematically discusses the mechanism of interface constraints on the mechanical

thermal and electrical properties of epoxy composite insulation materials

focusing on the key issues such as interface bonding

interface matching

interface heat transfer and interface charge transport. The main interface regulation strategies and research progress in recent years for these issues are reviewed

such as plasma surface modification

micro-nano compounding

and surface functionalization. In addition

this paper further analyzes the similarities and differences between the newly developed recyclable epoxy system and the traditional system regarding interface problems

and discusses the new challenges faced during regulation. Finally

the prospects in the future breakthrough direction of interface problems are put forward

offering insights for developing high-performance and environmentally friendly epoxy composite insulating materials of the next generation.