EN基于SolidWorks Flow Simulation的热电制冷箱装配体安装架构的仿真优化
Simulation and Optimization of Assembly Structure of Thermoelectric Refrigeration Box Based on SolidWorks Flow Simulation
- 发电技术 2021年42卷第3期 页码：374-381
- 作者机构：
浙江科技学院机械与能源工程学院, 浙江省 杭州市 310023
- 作者简介：
[ "邵夏勇(1992), 男, 硕士, 研究方向半导体车载冰箱, 1453350379@qq.com" ]
张治国(1980), 男, 博士, 教授, 研究方向为能源与环境系统工程, 本文通信作者, 107023@zust.edu.cn
- 基金信息：国家自然科学基金项目(51776188)
DOI：10.12096/j.2096-4528.pgt.19085
中图分类号： TK172;TU831收稿：2020-07-14，
纸质出版：2021-06-30
- 稿件说明：
移动端阅览
邵夏勇, 张治国, 李国能, 等. 基于SolidWorks Flow Simulation的热电制冷箱装配体安装架构的仿真优化[J]. 发电技术, 2021,42(3):374-381.
Xiayong SHAO, Zhiguo ZHANG, Guoneng LI, et al. Simulation and Optimization of Assembly Structure of Thermoelectric Refrigeration Box Based on SolidWorks Flow Simulation[J]. Power Generation Technology, 2021, 42(3): 374-381.
邵夏勇, 张治国, 李国能, 等. 基于SolidWorks Flow Simulation的热电制冷箱装配体安装架构的仿真优化[J]. 发电技术, 2021,42(3):374-381. DOI： 10.12096/j.2096-4528.pgt.19085.
Xiayong SHAO, Zhiguo ZHANG, Guoneng LI, et al. Simulation and Optimization of Assembly Structure of Thermoelectric Refrigeration Box Based on SolidWorks Flow Simulation[J]. Power Generation Technology, 2021, 42(3): 374-381. DOI： 10.12096/j.2096-4528.pgt.19085.
摘要
为了提高热电制冷箱的制冷性能，对市面上常见的热电(半导体)制冷箱进行分析，并对制冷箱的制冷装配体与箱壁之间的架构方式进行探究。采用仿真工具SolidWorks Flow Simulation对制冷箱的制冷装配体与箱壁之间的架构方式进行建模仿真。分析了重力、风扇方向、开槽尺寸、槽内所加支架等参数对半导体制冷箱制冷性能的影响规律，结果表明：制冷箱在开槽尺寸一定时，重力方向处于箱体尺寸最长边，风扇进气方向为吸气，槽内加对称支架，并对支架的4个侧面做尽可能多的圆形镂空处理，且圆越大越好，此时热电制冷箱的制冷性能最优。
Abstract
In order to improve the refrigeration performance of thermoelectric refrigeration box
the common thermoelectric (semiconductor) refrigeration box on the market was analyzed
and the structure between the refrigeration assembly of the refrigeration box and the wall of the box was explored. SolidWorks Flow Simulation was used to model and simulate the structure between the refrigeration assembly and the wall of the refrigeration box. The effects of gravity
fan direction
groove size and bracket on the refrigeration performance of semiconductor refrigeration box were analyzed. It is concluded that when the groove size is fixed
the cooling performance of thermoelectric refrigeration box is optimal when the gravity direction is at the longest side of the box size
the direction of fan intake is suction and symmetrical bracket is added in the groove. The four sides of the support are cut out as many circles as possible
and the larger the circle is
the better.
关键词
Keywords
references
SAMIRA P. Application of thermoelectric as an instant running-water cooler; experimental study under differentoperating conditions[J]. Applied Energy, 2018, 229: 364-374.
SÖYLEMEZ E, ALPMAN E, ONAT A, et al. Numerical (CFD) and experimental analysis of hybrid household refrigerator including thermoelectric and vapour compression cooling systems[J]. International Journal of Refrigeration, 2019, 99: 300-315.
徐德胜. 半导体制冷与应用技术[M]. 上海: 上海交通大学出版社, 1992: 1.
XU D S. Semiconductor refrigeration and application technology[M]. Shanghai: Shanghai Jiaotong University Press, 1992: 1.
时阳. 制冷技术[M]. 北京: 中国轻工业出版社, 2015: 4-5.
SHI Y. Refrigeration technology[M]. Beijing: China Light Industry Press, 2015: 4-5.
朱凌云, 李国能, 康泰云, 等. 基于生物质燃料的水冷式温差发电机的实验研究[J]. 发电技术, 2019, 40(2): 148-154.
ZHU L Y, LI G N, KANG T Y, et al. Experimental study on water cooled thermoelectric generator based on biomass fuel[J]. Power Generation Technology, 2019, 40(2): 148-154.
张晓芳, 钟建新, 杨穗. 水冷式半导体冰箱制冷性能的研究[J]. 工程设计学报, 2012, 19(2): 105-111.
ZHANG X F, ZHONG J X, YANG S. Study on refrigeration performance of water cooled semiconductor refrigerator[J]. Journal of Engineering Design, 2012, 19(2): 105-111.
谢万蓉, 屈宗长, 刘公衍, 等. 半导体冰箱热管及变工况控制的研究[J]. 低温与超导, 2013, 41(5): 69-74.
XIE W R, QU Z C, LIU G Y, et al. Study on heat pipe and off design control of semiconductor refrigerator[J]. Low Temperature and Superconductivity, 2013, 41(5): 69-74.
罗仲, 张旭, 王胜己, 等. 半导体制冷器除湿实验研究[J]. 制冷学报, 2015, 36(5): 101-106.
LUO Z, ZHANG X, WANG S J, et al. Experimental study on dehumidification of semiconductor cooler[J]. Acta Refrigeration Sinica, 2015, 36(5): 101-106.
陶海波, 朱小兵, 朱文印, 等. 半导体冰箱热端热管散热器温度分布特性研究[A]. 中国家用电器协会. 2016年中国家用电器技术大会论文集[C]. 中国家用电器协会: 《电器》杂志社, 2016: 6.
TAO H B, ZHU X B, ZHU W Y, et al. Study on the temperature distribution characteristics of the heat pipe radiator atthe hot end of semiconductor refrigerator[A]. China Household Electrical Appliance Association. Proceedings of 2016 China Household Appliance Technology Conference[C]. China Household Appliance Association: electrical appliance magazine, 2016: 6.
张晓波, 徐象国. 多目标约束下半导体制冷片几何结构参数的优化设计[J]. 制冷学报, 2018, 39(3): 22-30.
ZHANG X B, XU X G. Optimization design of geometric structure parameters of semiconductor refrigeration chip undermulti-objective constraints[J]. Acta Refrigeration Sinica, 2018, 39(3): 22-30.
吴迪, 曾国辉, 丁倩云. 基于推挽式供电和PID温控的半导体冰箱系统设计[J]. 计算机测量与控制, 2018, 26(11): 93-97.
WU D, ZENG G H, DING Q Y. Design of semiconductor refrigerator system based onpush-pull power supply and PID temperature control[J]. Computer Measurement and Control, 2018, 26(11): 93-97.
GÖKÇEK M, ŞAHIN F. Experimental performance investigation of minichannel water cooled-thermoelectric refrigerator[J]. Case Studies in Thermal Engineering, 2017, 10: 54-62.
ÇAĞLAR A. Optimization of operational conditions for a thermoelectric refrigerator and its performance analysis at optimum conditions[J]. International Journal of Refrigeration, 2018, 96: 70-77.
MORIA H, AHMED M, ALGHANMI A, et al. Experimental study of solar based refrigerator using thermoelectric effect[J]. Energy Procedia, 2019, 158: 198-203.
MIRMANTO M, SYAHRUL S, WIRDAN Y. Experimental performances of a thermoelectric cooler box with thermoelectric position variations[J]. Engineering Science and Technology, an International Journal, 2019, 22(1): 177-184.
DS SOLIDWORKS公司. SOLIDWORKS Flow Simulation教程[M]. 北京: 机械工业出版社, 2015.
DS SolidWorks. SolidWorks flow simulation course[M]. Beijing: China Machine Press, 2015.
J.P. 霍尔曼(J.P. Holman). 传热学[M]. 北京: 机械工业出版社, 2011.
HOLMAN J P. Heat transfer[M]. Beijing: China Machine Press, 2011.
孔祥谦. 热应力有限单元法分析[M]. 上海: 上海交通大学出版社, 1999.
KONG X Q. Finite element analysis of thermal stress[M]. Shanghai: Shanghai Jiaotong University Press, 1999.
张显雄, 张志田, 张伟峰, 等. 五种湍流涡粘模型在二维方柱绕流数值模拟中的对比研究[J]. 空气动力学学报, 2018, 36(2): 339-349.
ZHANG X X, ZHANG Z T, ZHANG W F, et al. Comparison of five turbulence eddy viscosity models in two-dimensional numerical simulation of flow around a square cylinder[J]. Acta Aerodynamics, 2018, 36(2): 339-349.
邵夏勇, Obinani Victor Chimdike, 沈博, 等. 基于SolidWorks Flow Simulation的车载半导体制冷箱的仿真分析[J]. 浙江科技学院学报, 2019, 31(5): 357-364.
SHAO X Y, Obinani Victor Chimdike, SHEN B, et al. Simulation analysis of vehicle mounted semiconductor refrigeration box based on SolidWorks flow simulation[J]. Journal of Zhejiang University of Science and Technology, 2019, 31(5): 357-364.
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