超强抗氧化铜膏的制备及键合性能研究

张昱; 黄钟伟; 刘强; 杨冠南; 崔成强

doi:10.12052/gdutxb.220146

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超强抗氧化铜膏的制备及键合性能研究

综合研究 | 更新时间：2026-05-27

- 超强抗氧化铜膏的制备及键合性能研究
- Preparation and Bonding Properties of Super Antioxidant Copper Paste
- 广东工业大学学报 2023年40卷第4期页码：117-124
- 作者机构：
  
  广东工业大学省部共建精密电子制造技术与装备国家重点实验室,广东,广州,510006
- 作者简介：
  
  张昱(1987–) ，女，副教授，博士，主要研究方向为微纳材料、柔性印刷电子、三维互连工艺及关键材料
  杨冠南(1989–)，男，副教授，博士，主要研究方向为先进微电子封装、金属激光加工等领域，E-mail：ygn@gdut.edu.cn
  崔成强(1963–)，男，教授，博士，主要研究方向为半导体先进封装工艺、封装基板、互连材料，E-mail：cqcui@gdut.edu.cn
- 基金信息：
  
  国家自然科学基金资助面上项目(62174039);广东省自然科学基金资助面上项目(2021A1515011642)
- DOI：10.12052/gdutxb.220146
  中图分类号： TQ352.7
- 网络首发：2023-07-25，
  
  纸质出版：2023
- 稿件说明：
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张昱, 黄钟伟, 刘强, 杨冠南, 崔成强. 超强抗氧化铜膏的制备及键合性能研究[J]. 广东工业大学学报, 2023, 40(4): 117-124.

Zhang Yu, Huang Zhong-wei, Liu Qiang, et al. Preparation and Bonding Properties of Super Antioxidant Copper Paste[J]. 2023, 40(4): 117-124.
张昱, 黄钟伟, 刘强, 杨冠南, 崔成强. 超强抗氧化铜膏的制备及键合性能研究[J]. 广东工业大学学报, 2023, 40(4): 117-124. DOI： 10.12052/gdutxb.220146.

Zhang Yu, Huang Zhong-wei, Liu Qiang, et al. Preparation and Bonding Properties of Super Antioxidant Copper Paste[J]. 2023, 40(4): 117-124. DOI： 10.12052/gdutxb.220146.

摘要

为了实现第三代半导体材料的广泛应用并提高第三代半导体器件的性能，开发新型的、高性能的封装互连材料成为了关键举措。其中，微纳米铜材料由于其具有表面效应和小尺寸效应等特点，能够在低温条件下烧结成高导电性、高导热性、高稳定性和耐电迁移性的块体结构，成为开发新型封装互连材料的研究热点。但是微纳米铜材料极易氧化、团聚和产率低的问题，限制了其在第三代半导体器件上的应用，提高微纳米铜材料的抗氧化性成为解决其应用的关键问题。本文采用苯并咪唑对微纳米铜材料进行处理，通过扫描电子显微镜、红外光谱等表征手段，证实了苯并咪唑对微纳米铜颗粒的包覆。对铜膏进行X射线衍射和X射线光电子能谱表征，证明该铜膏能够在空气中放置120 d不被氧化。将铜膏应用于烧结键合，300 ℃条件下制备的互连接头的强度达到了62.3 MPa，烧结体电阻率低至6.18×10

−8

Ω·m。研究结果表明，苯并咪唑处理微纳米铜材料的方法，可以实现微纳米铜材料的超强抗氧化和良好的互连性能，对第三代半导体封装互连材料的研究和发展具有深远意义。

Abstract

In order to realize the wide application and improve the performance of third-generation semiconductor devices

the development of new and high-performance packaging interconnect materials has become a key initiation. Among them

micro/nano copper material can be sintered into block structures with high electrical conductivity

high thermal conductivity

high stability and electromigration resistance under low temperature conditions due to its surface effect and small size effect

which has become a research hotspot for the development of new packaging interconnect materials.

However

the problems of easy oxidation

agglomeration and low yield of micro/nano copper material limit its application in third-generation semiconductor devices

and the oxidation resistance improvement of micro/nano copper material has become a key problem to solve its application. In this research

benzimidazole was used to treat micro/nano copper material

and the coating of micro/nano copper particles by benzimidazole was confirmed by Scanning Electron Microscope (SEM)

infrared spectroscopy and other characterization methods. The copper paste was subjected to X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) to prove that the paste could be left in air for 120 days without oxidation. The strength of the interconnect joint prepared at 300 °C reached 62.3 MPa

and the resistivity of the sintered layer was as low as 6.18×10

−8

Ω·m. The results show that the method of treating micro/nano copper material by benzimidazole can help it to achieve super oxidation resistance and good interconnection performance

which is of profound significance for the research and development of third-generation semiconductor packaging interconnect materials.

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references

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