EN考虑高海拔环境及键合线种类的焊接型IGBT电-热-力模型
考虑高海拔环境及键合线种类的焊接型IGBT电-热-力模型
- 华北电力大学学报（自然科学版） 2026年53卷第1期 页码：95-105
- 作者机构：
1. 河北省输变电设备安全防御重点实验室(华北电力大学
2. 国网西藏电力有限公司经济技术研究院
- 作者简介：
- 基金信息：国家电网有限公司科技项目(5500-202237345A-2-0-SY)
DOI：
中图分类号： TN322.8-
纸质出版：2026
- 稿件说明：
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[1]律方成,王炳强,平措顿珠,等.考虑高海拔环境及键合线种类的焊接型IGBT电-热-力模型[J].华北电力大学学报(自然科学版),2026,53(01):95-105.
律方成, 王炳强, 平措顿珠, et al. 考虑高海拔环境及键合线种类的焊接型IGBT电-热-力模型[J]. 2026, 53(1): 95-105.
摘要
焊接型IGBT作为高海拔地区光伏发电系统的关键部件，其可靠性直接决定光伏电站的稳定运行。然而缺少相应的高海拔地区的电-热-力耦合模型，同时有关高海拔地区由于芯片温升以及键合线所受应力过大造成的模块性能失效的研究也少之又少。为此根据IGBT模块内部电场、热场和力场之间的耦合作用关系，以焊接型IGBT为研究对象，建立铜、铝键合线的焊接型IGBT电-热-力耦合有限元模型，分别分析了不同海拔高度以及4 200 m特定海拔高度下每月的极端环境温度对铜、铝两种键合线种类的焊接型IGBT的最大结温与键合线最大应力的影响。研究表明，随着海拔升高，最大结温与键合线最大应力呈上升趋势；使用铜键合线的IGBT模块的最大结温低于使用铝键合线的IGBT模块的最大结温，但使用铜键合线的IGBT模块的最大应力值更高。该研究为高海拔地区优化键合线材料，提高IGBT模块运行稳定性提供了理论指导。
Abstract
As a key component of photovoltaic power generation systems in high-altitude areas
the reliability of welding IGBT directly determines the stable operation of photovoltaic power plants. However
there is a lack of corresponding electrical-thermal-mechanical coupling models in high-altitude areas
and little research exists on module performance failures caused by chip temperature rise and excessive stress on bonding wires in high altitude areas. Based on the coupling relationship between the internal electric field
thermal field
and mechanical field of the welding IGBT
a finite element model of the welding IGBT for copper and aluminum bonding wires is established. The model analyzes the effects of extreme environmental temperatures at different altitudes and specific altitudes of 4 200 m per month on the maximum junction temperature and maximum stress of the welding IGBT for both copper and aluminum bonding wires. Research shows that as altitude increases
the maximum junction temperature and maximum stress of the bonding wires exhibit an upward trend. The maximum junction temperature of IGBT using copper bonding wires is lower than that of those using aluminum bonding wires
but the maximum stress value of welding IGBT using copper bonding wires is higher. This study provides theoretical guidance for optimizing bonding wire materials and improving the operational stability of welding IGBT in high altitude areas.
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references
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