Due to the ‘filler’ effect

the pot insulators need to be solidified from bottom to top during the curing process

thus the epoxy is required to have a reasonable temperature gradient during curing. In order to study the influence of the structure of the oven on the temperature field distribution during the curing process of the insulator

a new oven structure was designed based on the existing oven

and the entire epoxy resin was used in the new and old ovens using the comsol finite element simulation software. Moreover

the solidification molding process was simulated. The simulation data show that

compared to the temperature distribution of the insulator cured in the old oven

the temperature distribution of the insulator cured in the new oven during the curing process is better

and the temperature required for curing can be reached faster. The test results of the temperature and strain during the curing process of the 1 100 kV basin insulator show that the temperature error of the new oven test data and simulation results is about 2%

which verifies the correctness of the simulation. Compared to the strain of the insulator cured in the old oven

the strain of the insulator cured in the new oven structure will be reduced by about 10%

indicating the superiority of the new oven.