With the development of miniaturization

high power and integration of electronic and electrical equipment

the functional and diversified demands for dielectric capacitors need to be increasingly met. Therefore

higher requirements are posed to energy storage dielectric materials for capacitors to adapt to more increasingly complex working environment. As an engineering plastic with excellent characteristics such as high temperature resistance

chemical corrosion resistance

and high thermal stability

polyimide is considered as a candidate material for high temperature resistant energy storage dielectric films. However

due to its relatively low dielectric permittivity

it has greatly affected its application as a high-temperature energy storage dielectric. According to the relationship between molecular structure and performance

the compromise of dielectric performance and heat resistance can be achieved by adjusting the space structure and configuration. Therefore

how to improve the dielectric and energy storage properties of polyimide intrinsically has become one of the key issues in the field that needs to be solved urgently. Based on the mechanism of improving the energy storage characteristics of polyimide

we analyzed the strategies for improving the energy storage characteristics of intrinsic high-temperature-resistant polyimide dielectric materials from the perspective of molecular structural design

including polymer molecular structure

synthesis of new monomers

polymer-metal complexation

and copolymerization modification. Finally

the current high-temperature energy storage polyimide dielectric research is summarized and the future development direction is expected

in order to realize the research and development of polymer films with excellent energy storage characteristics for next-generation capacitors.