压接型IGBT均流设计
Current-sharing Design of Press-Pack IGBT
-
摘要: 针对压接型绝缘栅双极晶体管(IGBT)内部均流设计,对多芯片压接结构及其压力均衡、压接型IGBT芯片内部均流、子单元间均流等方面进行了研究和优化设计。试验验证了压接型IGBT具有良好的电流关断能力、短路电流能力及反偏安全工作区,器件内部均流状态较好。Abstract: Aiming at the inner design of the press-pack IGBT devices, this paper focuses on the study and optimal design of these issues, such as multi-chip pressure contact and its pressure balancing, internal current-sharing and current balancing among sub-units. Testing results showed that the developed press-pack IGBT devices has promising capabilities of current turn-off, short-circuit current and RBSOA, which indicates their good ability of inner current sharing.