Abstract: Thermal-conductive electric-insulating materials are indispensable in ensuring the working efficiency and steady-state operation of microelectronic equipment and power equipment. However, with the increase of equipment power, it is difficult for the current mainstream silicon-based materials to meet the requirements of high-integration technology, microelectronic packaging, high-power power equipment and other key technologies that have requirements for material thermal conductivity, insulation and mechanical properties. It is urgent to develop the next generation of thermal-conductive electric insulating materials. Polymer-based thermal- conductive electric-insulating materials have attracted widespread attention due to their excellent insulation, thermal conductivity and mechanical ductility. Based on the influence of the internal structure of polymer matrix composites on thermal conductivity, insulation and mechanical properties, this paper mainly analyzes and summarizes the influence of filler type, content, filler size and the composite network of fillers on the thermal conductivity of polymers. The structural design method of the material and its application status in various fields are comprehensively sorted out and summarized, which provides guidance for the design and performance optimization of high thermal conductivity insulating composite materials and promotes its large-scale application.