Abstract: The progress of semiconductor technology has enabled the chip size to be continuously reduced, forcing the development and progress of packaging technology, which has also resulted in a variety of packaging forms. The current design and development of power devices are characterized by the attributes of low inductance, high heat dissipation and high insulation capability, and the development trend of modularity, multi-functionality and compactness in device packaging. To achieve low inductance design of packaged devices, the device package structure is more compact, while the chip voltage level and power density of package modules continue to increase, bringing challenges to package insulation and device heat dissipation. In the limited packaging space, how to release the heat dissipation of the chip to the external environment in a timely and efficient manner to reduce the chip junction temperature and the operating temperature of the internal packaging materials of the device, has become one of the important issues to be considered in the current power device packaging design phase. This paper focuses on the thermal aspects of the power device packaging structures and summarizes the structural design of power semiconductor devices in terms of thermal dissipation. Through the review of domestic and foreign power device packaging structure design, the consideration and thermal characteristics of power device packaging in terms of heat dissipation are summarized, and the types of power device packaging structure are classified according to the heat dissipation characteristics of power devices. Finally, based on the purpose of reducing the thermal resistance of the packaging structure and improving the heat dissipation capability of the device, the future development trend of device packaging structure design in terms of heat dissipation is prospected from four aspects: high thermal conductivity packaging materials and connection process, chip surface contact interconnection, increasing the heat dissipation paths and shortening the heat dissipation distance.