Abstract: With the popularization and application of high-voltage power modules in the fields of DC transmission, high-speed railway, and new energy power generation, the reliability issue of high-voltage power modules will become more and more prominent. In this paper, the latest research progress in packaging structure, insulation failure, and reliability improvement of high-voltage power modules was described. Firstly, according to the existing packaging structures of high-voltage power modules, the most widely used packaging structures of high-voltage silicon-based IGBT and SiC MOSFET modules and the types and characteristics of packaging insulating materials of high-voltage power modules were analyzed. Then the aging and failure mechanism of high-voltage power module packaging insulation, as well as the existing partial discharge evaluation standards and measurement methods were reviewed. In addition, the methods to improve the insulation reliability of high-voltage power modules were summarized. Based on the review, combined with the development trend of high-voltage power module miniaturization, integration, and high-temperature resistance, the main threats, challenges, and development trends of high-voltage power module packaging and insulation were pointed out.