刘兰香, 杨文英, 柴玉阳, 翟国富. 微小型继电器的刚柔耦合碰撞动力学建模方法与弹跳行为分析[J]. 中国电机工程学报, 2022, 42(2): 808-817. DOI: 10.13334/j.0258-8013.pcsee.202325
引用本文: 刘兰香, 杨文英, 柴玉阳, 翟国富. 微小型继电器的刚柔耦合碰撞动力学建模方法与弹跳行为分析[J]. 中国电机工程学报, 2022, 42(2): 808-817. DOI: 10.13334/j.0258-8013.pcsee.202325
LIU Lanxiang, YANG Wenying, CHAI Yuyang, ZHAI Guofu. Modeling Method of Rigid-flexible Coupling Impact Dynamics and Analysis of Bounce Behavior of the Micro-relay[J]. Proceedings of the CSEE, 2022, 42(2): 808-817. DOI: 10.13334/j.0258-8013.pcsee.202325
Citation: LIU Lanxiang, YANG Wenying, CHAI Yuyang, ZHAI Guofu. Modeling Method of Rigid-flexible Coupling Impact Dynamics and Analysis of Bounce Behavior of the Micro-relay[J]. Proceedings of the CSEE, 2022, 42(2): 808-817. DOI: 10.13334/j.0258-8013.pcsee.202325

微小型继电器的刚柔耦合碰撞动力学建模方法与弹跳行为分析

Modeling Method of Rigid-flexible Coupling Impact Dynamics and Analysis of Bounce Behavior of the Micro-relay

  • 摘要: 微小型继电器被广泛应用于航空航天、兵器、船舶等工程领域,特殊的工作环境要求其具有良好的接触性能。该类继电器含有的簧片结构动作时会伴有弹性变形,传统以刚体为假设条件的动态特性分析法显然不能满足计算要求和分析精度。因此,以某微小型继电器为例,提出一种耦合可动部件的刚体运动、柔性变形与结构碰撞作用的刚柔耦合碰撞弹跳分析方法;继电器簧片被等效为悬臂梁结构,建立了基于电、磁、力和柔性簧片位移微分方程的接触弹跳动力学模型。分析簧片发生变形前后的受力情况,研究闭合簧片接触–分离–接触的动力学特性。据此,详细计算不同的接触间隙、连杆位置和控制电压下继电器的接触弹跳变化规律。设计实验验证所提模型的准确性。研究发现,簧片弹性变形与碰撞过程的相互作用是引发继电器不稳定接触的重要原因。此外,适当减小接触间隙、缩短连杆推动位置与接触点间的距离能有效提高微小型继电器的接触性能。

     

    Abstract: Micro-relay is widely used in aerospace, weapons, ships and other engineering fields. Particularity of working environment requires it to have excellent contact behaviors. The reed structure of this kind of relay will deform when it moves, and the traditional dynamic analysis method of contact system based on rigid body assumption is obviously unable to meet the calculation requirements and analysis accuracy. Therefore, taking a micro-relay as an example, a rigid-flexible coupling impact dynamics and bouncing analysis method was proposed based on the coupling of rigid body motion, flexible deformation and structural collision process of movable parts. The reed is equivalent to a cantilever beam structure. Based on the differential equations of the electricity, magnetism, force and displacement of the reed, the contact bounce dynamic model of the relay was established. The forces of the reed before and after deformation were analyzed, and contact-separation-contact dynamic properties of the closed reed were studied. The contact bounce changes of the relay under different contact gaps, connecting rod positions and control voltages were calculated in detail. The accuracy of the proposed model was verified by experiment. It is found that the interaction between elastic deformation and collision process of the reed is the important reason for the unstable contact of the relay. In addition, appropriately reducing the contact gap, shortening the push distance between the connecting rod and the contact point can effectively improve the contact performance of the micro-relay.

     

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