许建中, 赵鹏豪, 江伟, 马巍巍, 赵成勇. 具备直流故障穿越能力的混合MMC可靠性分析和冗余配置方法[J]. 中国电机工程学报, 2016, 36(4): 953-960. DOI: 10.13334/j.0258-8013.pcsee.2016.04.008
引用本文: 许建中, 赵鹏豪, 江伟, 马巍巍, 赵成勇. 具备直流故障穿越能力的混合MMC可靠性分析和冗余配置方法[J]. 中国电机工程学报, 2016, 36(4): 953-960. DOI: 10.13334/j.0258-8013.pcsee.2016.04.008
XU Jianzhong, ZHAO Penghao, JIANG Wei, MA Weiwei, ZHAO Chengyong. Reliability Analysis and Redundancy Configuration of Hybrid MMCs With DC Fault Blocking Capability[J]. Proceedings of the CSEE, 2016, 36(4): 953-960. DOI: 10.13334/j.0258-8013.pcsee.2016.04.008
Citation: XU Jianzhong, ZHAO Penghao, JIANG Wei, MA Weiwei, ZHAO Chengyong. Reliability Analysis and Redundancy Configuration of Hybrid MMCs With DC Fault Blocking Capability[J]. Proceedings of the CSEE, 2016, 36(4): 953-960. DOI: 10.13334/j.0258-8013.pcsee.2016.04.008

具备直流故障穿越能力的混合MMC可靠性分析和冗余配置方法

Reliability Analysis and Redundancy Configuration of Hybrid MMCs With DC Fault Blocking Capability

  • 摘要: 模块化多电平换流器(modular multilevel converter,MMC)已经成为高压直流输电领域具有很大应用前景的换流器技术。目前已有许多具有直流故障穿越能力的MMC子模块(sub-module,SM)拓扑,并且由不同类型的SM构成的混合MMC同时具备了较强的直流故障箝位能力和低投资、低损耗的优点。重点研究具备直流故障穿越能力的混合MMC的可靠性分析和冗余配置方法,首先研究同时满足支撑直流电压和直流故障穿越能力的混合MMC中两类不同拓扑子模块的初始临界数目比例,进而同时考虑半导体器件的有效利用率及MMC的可靠性,通过计算三维曲面的一阶差分,提出两种子模块的最优冗余配置方案,最终得到具备直流故障穿越能力的混合MMC中子模块的最优配置方案。以实际工程参数为基准,分别计算两种混合MMC的最优子模块冗余配置方案,与采用单一可切断直流故障电流子模块拓扑的MMC相比,在满足可靠性需求的前提下,混合MMC所需器件数目明显降低。

     

    Abstract: Modular multilevel converter(MMC) has become the most promising converter technology for high voltage direct current(HVDC) transmission systems. MMC sub-module(SM) topologies with dc faults ride-through capabilities are emerging which are suitable for overhead line(OHL) applications. The hybrid SM design of each converter arm can get the compromise of higher capability of handling dc faults and lower capital investments and losses. The initial hybrid SM numbers design method for supporting the dc-link voltage and riding-through dc faults, as well as the optimized hybrid SM redundancy configuration strategy for effectively increasing the reliability of MMC were proposed and calculated. In contrast with previously developed redundancy configuration for MMC with single SM topology, this approach solves the first-order differences of the three-dimensional surface to calculate the recommended redundant hybrid SM numbers which takes both the semiconductor device utilization rate and the converter reliability of MMC into consideration.

     

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