梁瑞雪, 王健, 胡琦, 李庆民, 肖风良, 黄家旗. 直流GIL盆式绝缘子附近微米级金属粉尘的动力学行为与吸附机制研究[J]. 中国电机工程学报, 2020, 40(4): 1387-1396,1429. DOI: 10.13334/j.0258-8013.pcsee.190855
引用本文: 梁瑞雪, 王健, 胡琦, 李庆民, 肖风良, 黄家旗. 直流GIL盆式绝缘子附近微米级金属粉尘的动力学行为与吸附机制研究[J]. 中国电机工程学报, 2020, 40(4): 1387-1396,1429. DOI: 10.13334/j.0258-8013.pcsee.190855
LIANG Rui-xue, WANG Jian, HU Qi, LI Qing-min, XIAO Feng-liang, HUANG Jia-qi. Study on Kinetic Behavior and Adsorption Mechanism of the Micron Metal Dust Near the Basin-type Insulator in DC GIL[J]. Proceedings of the CSEE, 2020, 40(4): 1387-1396,1429. DOI: 10.13334/j.0258-8013.pcsee.190855
Citation: LIANG Rui-xue, WANG Jian, HU Qi, LI Qing-min, XIAO Feng-liang, HUANG Jia-qi. Study on Kinetic Behavior and Adsorption Mechanism of the Micron Metal Dust Near the Basin-type Insulator in DC GIL[J]. Proceedings of the CSEE, 2020, 40(4): 1387-1396,1429. DOI: 10.13334/j.0258-8013.pcsee.190855

直流GIL盆式绝缘子附近微米级金属粉尘的动力学行为与吸附机制研究

Study on Kinetic Behavior and Adsorption Mechanism of the Micron Metal Dust Near the Basin-type Insulator in DC GIL

  • 摘要: 直流GIS/GIL在生产、运行过程中往往会产生微米级的金属粉尘,可能导致绝缘子沿面闪络等严重故障。通过搭建半封闭式同轴圆柱电极实验平台,研究盆式绝缘子附近金属粉尘的运动行为与吸附机制。研究结果表明,金属粉尘主要表现为向绝缘子表面运动的"积聚式吸附"和向电极运动的"扩散式吸附"行为,且粉尘的积聚吸附量随施加电压增大会出现"极值"现象;微米级粉尘的积聚吸附呈明显的极性效应,负极性电压下的分布范围更广、吸附量更大且吸附过程更短;粉尘粒径越小,其吸附启举电压越高,越容易发生闪络,且随着粉尘量增多以及不断升压,还会导致粉尘的"爆炸"式行为。为揭示上述现象的发生机制,进一步建立金属粉尘的多物理场受力分析模型。在绝缘子表面和金属粉尘堆形成的"V形"区域内,左右两侧相反的畸变电场对金属粉尘的作用几近抵消,绝缘子表面电荷对带电金属粉尘的库仑力作用成为引发积聚吸附的关键因素,表面电荷极性则是极性效应的直接原因。粉尘堆远离绝缘子侧的畸变电场作用,是造成带电金属粉尘扩散吸附的影响因素。库仑引力和畸变电场力的交互作用,造成积聚吸附量的"极值"现象。微米级金属粉尘粒子间的范德华力作用,则是导致粉尘粒径越小而吸附启举电压越高的主要原因。

     

    Abstract: Metal dust of micron level is often generated during the production and operation process of DC GIS/GIL, probably causing serious faults such as surface flashover of insulators. In this paper, a semi-closed coaxial cylindrical electrodes platform was built as to study the movement behavior and adsorption mechanism of the micro metal dust near the basin-type insulator, and unique phenomenon was obtained. Two adsorption modes of the metal dust was discovered, one is featured as "accumulative adsorption" moving towards the insulator surface, and the other is featured as "diffusive adsorption" moving towards the electrodes, meanwhile, "extreme value" phenomenon may appear with increase of the imposed voltage amplitude. The accumulative adsorption renders obvious polar effect, namely for the negative polarity case, the adsorption range is wider, the adsorption amount is larger and the completion time is shorter. The smaller the dust particle size is, the higher the adsorption lifting voltage will be, and the more likely a flashover will occur, what more, the increase in dust amount and imposed voltage may lead to "explosion" of the metal dust. Further, a stress analysis model under multi-physical fields was established to account for the experimental phenomenon. In the "V" shaped area formed by the insulator surface and the metal dust heap, the opposite effect of distorted electric field on the left and right sides almost offsets to the metal powder, hence,the principal influential factor on metal dust accumulative adsorption turns to be the coulomb force on the charged particles by the insulator surface charge, while the polarity of the insulator surface charge contributes directly to the polarity effect of accumulative adsorption. The main impacting factor on diffusive adsorption of mental dust lies in the distorted electric field stress on the far-away side of the charged dust pile from the insulator. The interaction between coulomb force and distorted electric field force causes the phenomenon of "extreme value" of accumulated adsorption. In addition, the prominent effect of inter-particle van der Waals force pays a key role, which can elucidate the facts that micron metal dust of smaller particle size manifests a higher adsorption start-up voltage.

     

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