李强, 杜飞宏, 冯嘉旺, 施骏业, 陈江平, 钱小石. 高综合性能电卡复合材料及大功率制冷器件[J]. 太阳能学报, 2024, 45(7): 420-426. DOI: 10.19912/j.0254-0096.tynxb.2023-0384
引用本文: 李强, 杜飞宏, 冯嘉旺, 施骏业, 陈江平, 钱小石. 高综合性能电卡复合材料及大功率制冷器件[J]. 太阳能学报, 2024, 45(7): 420-426. DOI: 10.19912/j.0254-0096.tynxb.2023-0384
Li Qiang, Du Feihong, Feng Jiawang, Shi Junye, Chen Jiangping, Qian Xiaoshi. COMPOSITES WITH ENHANCED THERMAL CONDUNCTIVITY AND ELECTROCALORIC STRENGTH FOR HIGH-POWER REFRIGERATION APPLICATIONS[J]. Acta Energiae Solaris Sinica, 2024, 45(7): 420-426. DOI: 10.19912/j.0254-0096.tynxb.2023-0384
Citation: Li Qiang, Du Feihong, Feng Jiawang, Shi Junye, Chen Jiangping, Qian Xiaoshi. COMPOSITES WITH ENHANCED THERMAL CONDUNCTIVITY AND ELECTROCALORIC STRENGTH FOR HIGH-POWER REFRIGERATION APPLICATIONS[J]. Acta Energiae Solaris Sinica, 2024, 45(7): 420-426. DOI: 10.19912/j.0254-0096.tynxb.2023-0384

高综合性能电卡复合材料及大功率制冷器件

COMPOSITES WITH ENHANCED THERMAL CONDUNCTIVITY AND ELECTROCALORIC STRENGTH FOR HIGH-POWER REFRIGERATION APPLICATIONS

  • 摘要: 通过制备BaZr0.2Ti0.8O3-P(VDF-TrFE-CFE)复合材料来改善聚合物基电卡材料的综合性能,设计基于流固耦合传热的大功率制冷器件并通过有限元仿真来评估以不同电卡材料为制冷核心元件的器件制冷能力和效率。结果表明:相较于基础聚合物,BZT质量分数为10%的复合材料T-BZT-10%具有显著优异的电卡制冷性能和导热性能。在10 K的温度跨度下,以TBZT-10%为制冷核心元件的电卡器件可实现31.0 W/cm3的制冷功率密度和1060.4 W的总制冷功率为基础电卡制冷器件的10倍),且COP达到5.2。

     

    Abstract: Here the electrocaloric effect(ECE) and thermal conductivity of polymer-based electrocaloric(EC) materials are improved by means of the preparation of BaZr0.2Ti0.8O3-P(VDF-TrFE-CFE) nanocomposites. In addition, high-power refrigeration devices based on fluid-solid conjugated heat transfer were designed and numerical simulations were carried out to evaluate the cooling capacity and efficiency. The results show that T-BZT-10%(with a BZT mass fraction of 10%) has significantly ECE and heat transfer performance than that of the base terpolymer. Simulation results about the devices show that at a temperature span of 10 K, a system with T-BZT-10%as the core refrigeration element can achieve a cooling power density of 31.0 W/cm~3 and total cooling power of 1060.4 W(more than a 10-fold cooling power improvement than that of the base EC device) with a COP of 5.2.

     

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