Abstract: In the production process of solar cells,traditional silicon wafer handling mechanisms have problems such as low handling efficiency,easy occurrence of poor silicon wafer edging,and poor suction cup marks,and cannot online detection poor silicon wafer edging. This paper studies a silicon wafer handling mechanism based on multi camera machine vision technology. Based on the analysis of the mechanical structure and action process of traditional silicon wafer handling mechanisms,the action process,mechanical structure,and characteristics of the silicon wafer handling mechanism based on multi camera machine vision technology are introduced. The principle of using multi camera machine vision technology to achieve silicon wafer position detection and online detection of poor silicon wafer edging is analyzed,and the advantages of this mechanism compared to traditional silicon wafer handling mechanisms are proposed. Its innovation lies in the introduction of multi camera machine vision technology and unique action process,thereby solving the problems of suction cup marks,scratches,hidden cracks,and other defects during silicon wafer handling. The research results have opened up ideas for the application of multi camera machine vision technology in PV automation equipment. The new silicon wafer handling mechanism has achieved global leading production efficiency and yield in the practical application of PVD automation equipment.