Abstract: Solar grade silicon wafers can be severely contaminated during diamond wire cutting and polishing processes,and physical or chemical methods need to be used to remove surface pollutants to meet the requirements for cleanliness and surface condition before velvet production of silicon wafers. In order to reduce excessive corrosion of silicon wafers and maintain the durability of the cleaning solution,this paper conducts experiments using orthogonal test method to determine the optimal ratio of surfactant components in the silicon wafers cleaning solution. The results show that: 1) The optimal ratio of surfactant components is FMEE: EDDHANa:FMES:PAS: APG=7:8:3:5:4;2) The silicon wafer cleaning solution configured according to the optimal ratio is phosphorus free,environmentally friendly,and has a long cleaning performance. After being applied to the actual silicon wafer cleaning process,the defect rate of the silicon wafer is less than 0.5%,which meets the actual production requirements of the factory.