郭佳奇, 张一鸣, 邓二平, 崔翔. 考虑接触界面全接触的压接型IGBT器件功率循环寿命预测[J]. 华北电力大学学报(自然科学版), 2023, 50(2): 63-72.
引用本文: 郭佳奇, 张一鸣, 邓二平, 崔翔. 考虑接触界面全接触的压接型IGBT器件功率循环寿命预测[J]. 华北电力大学学报(自然科学版), 2023, 50(2): 63-72.
GUO Jiaqi, ZHANG Yiming, DENG Erping, CUI Xiang. Prediction of Power Cycle Life of Press-Pack IGBTs Considering Full Contact of Contact Interface[J]. Journal of North China Electric Power University, 2023, 50(2): 63-72.
Citation: GUO Jiaqi, ZHANG Yiming, DENG Erping, CUI Xiang. Prediction of Power Cycle Life of Press-Pack IGBTs Considering Full Contact of Contact Interface[J]. Journal of North China Electric Power University, 2023, 50(2): 63-72.

考虑接触界面全接触的压接型IGBT器件功率循环寿命预测

Prediction of Power Cycle Life of Press-Pack IGBTs Considering Full Contact of Contact Interface

  • 摘要: 柔性直流输电技术的飞速发展,对换流阀用压接型IGBT器件的可靠性要求进一步提高。目前针对压接IGBT可靠性寿命模型的研究存在不足,一方面,大多数模型对接触问题考虑不全面,物理模型为焊接形式或不能滑动的联合体,不符合实际物理机理,因此可靠性模型不能全面真实反映实际情况。另一方面,解析寿命模型的拟合方法,无法单一控制变量完全解耦,单变量拟合曲线并不能准确反应变量与可靠性寿命的关系。建立了考虑全部接触问题的功率循环计算模型,针对压接型器件的封装特点引入压力作为新变量,提出一种采用改进多元线性回归拟合方法的多变量寿命模型,该分析方法可应用于压接型IGBT在功率循环下的可靠性评估。通过有限元计算结果验证,多变量寿命模型相比单变量拟合更加准确。

     

    Abstract: The rapid development of flexible direct current transmission technology has further improved the reliability requirements of Press-Pack IGBTs for converter valves. The current researches on the reliability life model of Press-Pack IGBTs are insufficient. On the one hand, most models do not fully consider contact problems: the physical model is a welding form or a non-slidable combination, which does not conform to the physical mechanism. This makes the reliability model inaccurate and cannot truly reflect the actual situation. On the other hand, the fitting method of the analytical life model cannot completely decouple the single control variable, and the single variable fitting curve cannot accurately reflect the relationship between the variable and the reliability life. In this paper, we established a power cycle calculation model which considers all contact problems. We introduced pressure as a new variable for the packaging characteristics of Press-Pack devices and proposed a multivariate life model using an improved multiple linear regression fitting method. This analysis method can be applied to evaluate the reliability of Press-Pack IGBTs under power cycle. Through the finite element calculation, it is verified that the multivariate life model is more accurate than the univariate fitting.

     

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