Abstract: With the development of miniaturization and high-power in electrical and electronic equipment, heat dissipation becomes the key issue. Thermal conductive composites with boron nitride (BN) as filler are an effective way to improve this problem. This paper analyzes the ways to improve the thermal conductive of BN modified polymer-based composites from three aspects, namely, single filler treatment (including the exfoliation of BN and surface modified BN), synergistic effect of composite filler, and construction of thermal conductive network, starting from the structural characteristics of BN. Finally, the problems existing in the current research on BN modified polymer-based thermal conductive composites are summarized, and the prospects in future development direction of thermal conductive composites is put forward, aiming to realize the high heat dissipation efficiency in limited space.