孟伟, 李学宝, 张金强, 赵志斌, 崔翔, 王亮. 温度对碳化硅器件封装用有机硅弹性体陷阱特性的影响[J]. 高电压技术, 2023, 49(2): 577-587. DOI: 10.13336/j.1003-6520.hve.20221334
引用本文: 孟伟, 李学宝, 张金强, 赵志斌, 崔翔, 王亮. 温度对碳化硅器件封装用有机硅弹性体陷阱特性的影响[J]. 高电压技术, 2023, 49(2): 577-587. DOI: 10.13336/j.1003-6520.hve.20221334
MENG Wei, LI Xuebao, ZHANG Jinqiang, ZHAO Zhibin, CUI Xiang, WANG Liang. Trap Characteristics with Their Temperature-dependence of Silicone Elastomer for Encapsulation in SiC Devices[J]. High Voltage Engineering, 2023, 49(2): 577-587. DOI: 10.13336/j.1003-6520.hve.20221334
Citation: MENG Wei, LI Xuebao, ZHANG Jinqiang, ZHAO Zhibin, CUI Xiang, WANG Liang. Trap Characteristics with Their Temperature-dependence of Silicone Elastomer for Encapsulation in SiC Devices[J]. High Voltage Engineering, 2023, 49(2): 577-587. DOI: 10.13336/j.1003-6520.hve.20221334

温度对碳化硅器件封装用有机硅弹性体陷阱特性的影响

Trap Characteristics with Their Temperature-dependence of Silicone Elastomer for Encapsulation in SiC Devices

  • 摘要: 有机硅弹性体作为一种高分子聚合物,因具有良好的耐高温性能、绝缘强度以及与芯片的相容性,已在碳化硅功率器件中得到应用。目前国内外针对有机硅弹性体在高温下的绝缘特性研究较少,而介质的陷阱特性与其绝缘性能密切相关,研究有机硅弹性体的陷阱特性及其受温度的影响,对于该种灌封材料在碳化硅器件封装中的应用具有重要意义。为此,采用表面电位衰减法(surface potential decay,SPD)测量了有机硅弹性体在温度20~250 ℃范围内的表面电位衰减曲线,提取了不同温度下有机硅弹性体的陷阱电荷能级密度分布和迁移率等微观参数,建立了有机硅弹性体迁移时间、迁移率、电位衰减时间常数随温度变化的拟合表达式,分析了温度对有机硅弹性体陷阱特性的影响机制,确定了有机硅弹性体陷阱捕获电荷数量最大时的温度阈值。此外,结合有机硅弹性体陷阱特性,从载流子输运的角度解释了该材料电导率、迁移率以及深浅陷阱的电位衰减时间常数之差随温度变化的规律,并通过分析有机硅弹性体的微观结构特征,解释了该材料陷阱特性的极性效应。相关结果可以为不同温度下有机硅弹性体绝缘特性的认知提供支撑。

     

    Abstract: Silicone elastomer, as a kind of high molecular polymer, has been applied in SiC power module because of its fine high-temperature resistance, insulation strength and internal compatibility with chips. At present, the studies on the insulation properties of silicone elastomers at high temperature are rarely available in the literature, and the trap characteristics of the dielectric are closely related to its insulation properties. Therefore, it is of great significance to study the trap characteristics of silicone elastomer and its temperature-dependence for the application of this kind of encapsulant in SiC device packaging. In this paper, the surface potential decay (SPD) method is used to measure the surface potential decay curve of silicone elastomer in the temperature range of 20~250 ℃. The microscopic parameters such as trap energy level, trapped charge density, and mobility of silicone elastomer at different temperatures are extracted, and the fitting expressions of silicone elastomer mobility and potential decay time constant with temperature are established. The influence mechanism of temperature on the trap characteristics of silicone elastomer is analyzed, and the temperature threshold for the maximum quantity of trapped charges in silicone elastomer is determined. In addition, combined with the trap characteristics of silicone elastomer, the patterns of the conductivity, mobility and the potential decay time constant difference between deep and shallow trap of the material changing with temperature are explained from the perspective of carrier transport. The polarity effect of the trap characteristics of silicone elastomer is explained through its microstructure. The relevant results can provide support for the cognition of the insulation characteristics of silicone elastomer at different temperatures.

     

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