For silicon heterojunction (SHJ) solar cells based on n-type crystalline silicon (c-Si) wafers
the electrode metallization pattern is optimized to realize high conversion efficiency by simulating the current-voltage () performance of the solar cells via Griddler software. Experimental validation of the simulation results confirm the accuracy of the simulation model. The optimization for copper electrodes prepared by copper-plating and silver electrodes prepared by screen-printing are both investigated and compared with respect to the comb-like pattern composed of fingers and busbars perpendicularly. This study includes the number of copper-plated busbars
a comparison of the electrical performance between copper-plated and screen-printed silver fingers
and the influence of copper electrode height. Optimal parameters for achieving high efficiency with copper-plated electrodes in SHJ solar cells are proposed. The optimal values are found to be 12 busbars
a busbar spacing of 13.85 mm
and a finger spacing of 1.410 mm with a width of 20 μm for the copper-plated electrodes
resulting in an efficiency improvement of 0.17% over the best efficiency achieved with screen-printed silver electrodes. Theoretically
the higher the electrode height
the higher the efficiency. By utilizing the optimal spacing between the busbars and fingers
the grid design can be effectively adapted and scaled for application to solar cells of different sizes.
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