单玻TOPCon组件DH失效机理研究

吴韦; 吕琳; 张衍; 付呈刚; 陈善勇; 杨伟光

doi:doi:10.19912/j.0254-0096.tynxb.2024-2052

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单玻TOPCon组件DH失效机理研究

更新时间：2026-04-08

- 单玻TOPCon组件DH失效机理研究
- Vol. 47, Issue 3, Pages: 753-759(2026)
- 作者机构：
- 作者简介：
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- DOI：doi:10.19912/j.0254-0096.tynxb.2024-2052
  CLC： TK51
- Online First：07 April 2026，
  
  Published：2026
- 稿件说明：
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吴韦, 吕琳, 张衍, et al. 单玻TOPCon组件DH失效机理研究[J]. 2026, 47(3): 753-759.
DOI：

吴韦, 吕琳, 张衍, et al. 单玻TOPCon组件DH失效机理研究[J]. 2026, 47(3): 753-759. DOI： doi:10.19912/j.0254-0096.tynxb.2024-2052.

摘要

研究揭示单玻隧穿氧化层钝化接触（TOPCon）组件在湿热条件下的3种失效机制：1）细栅线遭受腐蚀;2）焊带和主栅互连区域的腐蚀;3）焊带、主栅和电池片互连区域的失效。湿热失效的原因在于Ag-Al浆料、湿气、焊接助焊剂与封装材料（EPE/EVA）产生的乙酸及含有Na+和Cl-的污染物引起的电化学腐蚀

导致组件内部互连弱化

最终产生失效。通过对不同焊接方案的差异化研究

采用覆膜一体化焊接技术

凭借创新封装工艺能有效阻隔腐蚀介质渗透

表现出优异的抗湿热能力

可为提升单玻TOPCon组件的抗湿热性能提供解决方案。

Abstract

This investigation reveals three failure mechanisms of glass-backsheet tunnel oxide passivating contact （TOPCon） modules under damp heat conditions： 1） corrosion of the fine grid lines; 2） corrosion around the interconnected areas of the busbars and solder ribbons; and 3） failure of the solder ribbons

main busbars and cell interconnection regions. Damp heat failure is caused by electrochemical corrosion due to Ag-Al paste

moisture

acetic acid from solder fluxes and encapsulation materials （EPE/EVA）

and contaminants containing Na+ and Cl-

which leads to weakening of the interconnections within the component

and ultimately to failure. Through the comparative study of different welding solutions

the use of Integrated Film Covering welding technology can effectively block the penetration of corrosive media by virtue of the innovative encapsulation process

showing excellent resistance to damp heat

and providing the solution to enhance the damp-heat-resistant performance of the single-glass TOPCon modules.

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references

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