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基于串扰电压峰值的IGBT模块键合线老化监测方法
更新时间:2025-12-02
    • 基于串扰电压峰值的IGBT模块键合线老化监测方法

    • Vol. 46, Issue 6, Pages: 314-320(2025)
    • DOI:doi:10.19912/j.0254-0096.tynxb.2024-0205    

      CLC: TM464
    • Published Online:07 July 2025,

      Published:2025

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  • 张硕, 王耕籍, 尹金良, et al. 基于串扰电压峰值的IGBT模块键合线老化监测方法[J]. 2025, 46(6): 314-320. DOI: doi:10.19912/j.0254-0096.tynxb.2024-0205.

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