Experimental Study of a New Ultra-Thin Loop Heat Pipe

ZHANG Hanyu; LIU Zhichun

doi:10.3969/j.issn.1008-0198.2025.04.016

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Experimental Study of a New Ultra-Thin Loop Heat Pipe

更新时间：2025-11-11

- Experimental Study of a New Ultra-Thin Loop Heat Pipe
- Vol. 45, Issue 4, Pages: 112-118(2025)
- 作者机构：
  
  华中科技大学热科学与工程实验室,湖北,武汉,430074
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.1008-0198.2025.04.016
  CLC： TK172.4
- Published Online：05 September 2025，
  
  Published：05 September 2025
- 稿件说明：
移动端阅览
张寒宇, 刘志春. 新型超薄环路热管的实验研究[J]. 湖南电力, 2025, 45(4): 112-118.

ZHANG Hanyu, LIU Zhichun. Experimental Study of a New Ultra-Thin Loop Heat Pipe[J]. 2025, 45(4): 112-118.
张寒宇, 刘志春. 新型超薄环路热管的实验研究[J]. 湖南电力, 2025, 45(4): 112-118. DOI： 10.3969/j.issn.1008-0198.2025.04.016.

ZHANG Hanyu, LIU Zhichun. Experimental Study of a New Ultra-Thin Loop Heat Pipe[J]. 2025, 45(4): 112-118. DOI： 10.3969/j.issn.1008-0198.2025.04.016.

摘要

目前移动电子设备日益增长的高性能与轻薄化需求

对环路热管（loop heat pipe

LHP）的散热能力及厚度提出了更高要求。面向移动电子器件热管理需求

设计并制备0.71 mm厚度的新型超薄平板式LHP。在充灌率38%、无重力倾角条件下

通过实验测试系统在不同热负荷与风冷条件下的热性能。结果表明系统最大传热量达16 W

且在4~16 W热输入范围内均能稳定启动并呈现良好热响应特性。环路热阻随热输入增大而升高

最低值为1.36 ℃/W。研究表明

所设计的超薄LHP可满足峰值功耗16 W的芯片散热需求

在移动电子器件热管理领域具有显著应用潜力。

Abstract

The increasing demand for high performance and thinness of mobile electronic devices has put forward higher requirements on the heat dissipation capability and thickness of loop heat pipes (LHPs). In order to meet the thermal management requirements of mobile electronic devices

a new type of ultra-thin flat-plate LHP with a thickness of 0.71 mm is designed and prepared

and the thermal performance of the system is experimentally tested under different thermal loads and air-cooling conditions with a filling rate of 38% and no gravitational inclination. The results show that the maximum heat transfer of the system reaches 16 W

and the system can be stably activated and shows good thermal response characteristics in the range of 4~16 W thermal input. The thermal resistance of the loop increases with the increase of thermal input

and the lowest value is 1.36 ℃/W. The study shows that the designed ultra-thin LHP can meet the heat dissipation demand of the chip with a peak power consumption of 16 W

and it has a significant potential for the application in the field of thermal management of mobile electronic devices.

关键词

Keywords

references

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