A Survey of Grinding Wheel for Precision Grinding of Silicon Wafer

Ren Qing-lei; Wei Xin; Xie Xiao-zhu; Hu Wei

doi:10.3969/j.issn.1007-7162.2016.02.004

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A Survey of Grinding Wheel for Precision Grinding of Silicon Wafer

更新时间：2026-05-27

- A Survey of Grinding Wheel for Precision Grinding of Silicon Wafer
- Vol. 33, Issue 2, Pages: 19-23(2016)
- 作者机构：
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.1007-7162.2016.02.004
  CLC：
- Online First：23 March 2016，
  
  Published：2016
- 稿件说明：
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任庆磊, 魏昕, 谢小柱, 胡伟. 硅片精密磨削用砂轮的研究综述[J]. 广东工业大学学报, 2016, 33(2): 19-23.

Ren Qing-lei, Wei Xin, Xie Xiao-zhu, et al. A Survey of Grinding Wheel for Precision Grinding of Silicon Wafer[J]. 2016, 33(2): 19-23.
任庆磊, 魏昕, 谢小柱, 胡伟. 硅片精密磨削用砂轮的研究综述[J]. 广东工业大学学报, 2016, 33(2): 19-23. DOI： 10.3969/j.issn.1007-7162.2016.02.004.

Ren Qing-lei, Wei Xin, Xie Xiao-zhu, et al. A Survey of Grinding Wheel for Precision Grinding of Silicon Wafer[J]. 2016, 33(2): 19-23. DOI： 10.3969/j.issn.1007-7162.2016.02.004.

摘要

砂轮作为硅片精密磨削加工过程中的关键加工工具备受关注.对硅片精密磨削用砂轮的国内外研究情况进行了总结分析，认为在其制备技术研究方面还需进一步的理论支撑；在磨损与观测评价方法研究方面，宜从砂轮建模入手，结合磨削硅片的材料特性，建立不同磨削阶段的砂轮磨削磨损模型；分析其磨损机理，同时优选砂轮观测评价方法，试验验证磨损过程.

Abstract

The grinding wheel is a key processing tool in the precision grinding of silicon wafer. The domestic and foreign research on the grinding wheel for wafer precision grinding is summarized and analyzed

proposing that research on wheel preparation technology need further theoretical support. The research on the wheel wear and evaluation method of observation should firstly establish the wheel model

and analyze the wheel wear mechanism of the different grinding stages according to the material properties of silicon wafer

and finally validate wear process by grinding experiments and using the preferred wheel observation and evaluation method.

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