A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv

Weng Jian-cheng; He Xiao-qi; Zhou Bin; Liu Gang-gang; Zhao Lei; En Yun-fei

doi:10.3969/j.issn.1007-7162.2014.04.020

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A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv

更新时间：2026-05-27

- A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv
- Vol. 31, Issue 4, Pages: 104-108(2014)
- 作者机构：
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- DOI：10.3969/j.issn.1007-7162.2014.04.020
  CLC：
- Online First：28 December 2014，
  
  Published：2014
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翁建城, 何小琦, 周斌, 刘岗岗, 赵磊, 恩云飞. 一种计算对流空气条件下MCM器件结温的方法[J]. 广东工业大学学报, 2014, 31(4): 104-108.

Weng Jian-cheng, He Xiao-qi, Zhou Bin, et al. A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv[J]. 2014, 31(4): 104-108.
翁建城, 何小琦, 周斌, 刘岗岗, 赵磊, 恩云飞. 一种计算对流空气条件下MCM器件结温的方法[J]. 广东工业大学学报, 2014, 31(4): 104-108. DOI： 10.3969/j.issn.1007-7162.2014.04.020.

Weng Jian-cheng, He Xiao-qi, Zhou Bin, et al. A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv[J]. 2014, 31(4): 104-108. DOI： 10.3969/j.issn.1007-7162.2014.04.020.

摘要

研究多芯片组件（Multi-chip Module，MCM）各元器件之间热传导的相互影响，建立了在对流空气条件下，一种基于结环热阻矩阵的MCM各元器件结温数学计算方法，并利用有限元模拟方法根据不同组合条件对结环热阻矩阵进行验证，结果表明采用结环热阻矩阵预测元器件结温的误差小于6%，说明该方法在某种程度上可运用于对流空气条件下MCM组件的热学分析技术中.

Abstract

It investigated the influence of heat exchange between each chip on MCM

and presented the mathematical calculation method for the junction-temperature of MCM chips under the condition of air convection

based on junction-ambient thermal resistance matrix. Comparison between the results of ANSYS finite element simulation and calculated results via this method under different combination conditions shows that the error margin of junction-temperature forecast by junction-ambient thermal resistance matrix is less than 6%

which indicates that the junction-ambient thermal resistance matrix can be applied to heat analysis for MCM to some extent.

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