1. 天津工业大学材料科学与工程学院
2. 江西省科学院能源研究所
Published:2024
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李世杰, 李建新, 高中琦, et al. 硫酸高铈添加剂对超薄电解铜箔结构和力学性能的影响[J]. 2024, 16(3): 91-97.
李世杰, 李建新, 高中琦, et al. 硫酸高铈添加剂对超薄电解铜箔结构和力学性能的影响[J]. 2024, 16(3): 91-97. DOI: 10.16056/j.2096-7705.2024.03.014.
为提升超薄电解铜箔的力学性能,通过在电解液中添加不同质量浓度的硫酸高铈,研究其对超薄电解铜箔结构和力学性能的影响。结果表明:当Ce(SO
4
)
2
质量浓度为15 mg/L时,所制备的超薄电解铜箔抗拉强度为457 MPa,延伸率为5.23%,较未添加的电解铜箔抗拉强度和延伸率分别提升了16%和78%,这是因为Ce(SO
4
)
2
的加入增大了铜电沉积过电位,加快了铜离子在阴极表面扩散速率,Ce
4+
为Cu
2+
的沉积提供了活性位点,使得铜晶核大量生成,抑制铜晶体生长,细化铜晶体晶粒大小。Ce(SO
4
)
2
的加入可改善超薄电解铜箔形貌结构以及提升其力学性能。
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