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Breakdown characteristics of silicone gel for power semiconductor device packaging under steep voltage rise rate
更新时间：2026-10-18

    • Breakdown characteristics of silicone gel for power semiconductor device packaging under steep voltage rise rate

    • Electric Machines and Control   Vol. 29, Issue 6, Pages: 63-70(2025)

    • DOI：10.15938/j.emc.2025.06.007    

      CLC： TM614

    • Received：12 November 2024，

      Published：2025-06

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  • SU Dazhi, ZENG Fuping, HUANG Meng, et al. Breakdown characteristics of silicone gel for power semiconductor device packaging under steep voltage rise rate[J]. Electric Machines and Control, 2025, 29(6): 63-70. DOI： 10.15938/j.emc.2025.06.007.

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