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Simulation study on effect of temperature on partial discharge inside void defects under closed conditions
更新时间：2025-06-26

    • Simulation study on effect of temperature on partial discharge inside void defects under closed conditions

    • Electric Machines and Control   Vol. 28, Issue 2, Pages: 1-10(2024)

    • DOI：10.15938/j.emc.2024.02.001    

      CLC： TM835

    • Received：31 August 2023，

      Published：2024-02

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  • ZHENG Quanfu, ZHANG Zhaoqi, LUO Lingen, et al. Simulation study on effect of temperature on partial discharge inside void defects under closed conditions[J]. Electric Machines and Control, 2024, 28(2): 1-10. DOI： 10.15938/j.emc.2024.02.001.

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