Discharge plasma is widely used in semiconductor chip manufacturing

including lithography

etching

thin film deposition

ion implantation

and plasma cleaning. The technology of discharge plasma occupies more than one third of the integrated circuit industry and has developed into a key technology in the field of chip manufacturing processes and equipment. This paper provides an overview of the typical applications of gas discharge and plasma in the field of chip manufacturing. Firstly

for lithography light source systems

the basic principles of gas discharge-pumped excimer lasers and extreme ultraviolet light generated by laser-produced plasmas are introduced. The essence of both is to utilize the light radiation generated by plasma. Secondly

for the radio frequency plasma used in etching

the generation

characteristics

control and related process technologies of low-pressure radio frequency discharge are introduced. Thirdly

the principles of thin film process

ion implantation equipment and related discharge plasma technology are introduced and discussed. Subsequently

in the aspects of measurement and detection

the characteristics of optical detection and electron beam detection are introduced respectively

and the basic principles and characteristics of laser sustained plasma to realize wide-spectrum strong radiation light source are elaborated. Finally

the plasma cleaning technology based on glow discharge and its application in removing etching residues are introduced. By summarizing and sorting out the applications of gas discharge and plasma in semiconductor manufacturing and related core technologies

the research direction of the scientific basis of discharge plasma is clarified

which helps to solve the plasma technology bottleneck in the process of domestication of semiconductor equipment.