The introduction of dynamic bonds into insulating epoxy systems to prepare dynamic insulating epoxy (DIE) offers a promising solution for the green and sustainable development of electrical equipment. However

the tendency of DIE to creep over extended service periods compromises their structural integrity and stability

posing significant risks for high-safety electrical applications. To overcome this limitation

we proposed a strategy to enhance the glass transition temperature (Tg) of DIE by incorporating N-containing trifunctional epoxy resins into bifunctional bisphenol A epoxy. Tg was enhanced with the increasing of trifunctional epoxy content

significantly improving stability under service conditions. Additionally

transesterification catalyzed by 1

5

7-Triazabicyclo[4.4.0]dec-5-ene (TBD) and the self-catalytic properties of tertiary amines in the trifunctional epoxy facilitate topological rearrangement at elevated temperatures

maintaining good reprocessability. This approach effectively balances creep resistance and processability

offering a viable solution for practical applications in electrical insulation. Moreover

the proposed method can be extended to other dynamic polymer systems

broadening its potential industrial applications.