High-voltage IGBT modules' space charge becomes one of the main threats to packaging insulation safety. The distribution of space charge is not only related to operational conditions but also significantly affected by the internal temperature distribution. Therefore

taking high-voltage IGBT modules as the research object

we established a three-dimensional bipolar carrier model. On this basis

an electro-thermal-charge multiphysics coupling model for IGBT modules was constructed to obtain the 3D spatial distribution characteristics of space charge. The calculation results show a good agreement with experimental measurements

validating the effectiveness of the proposed model. Based on this

the influences of various operating conditions and different temperature distributions on the space charge distribution within the insulation packaging of IGBT modules were thoroughly investigated. The results indicate that the maximum space charge is located at the junction of the copper electrode

Al2O3 ceramic substrate

and packaging silicone. At the packaging silicone-IGBT interface

the higher the temperature is

the greater the space charge density will be

and the conduction current exhibits the highest sensitivity to space charge distribution. This study provides a theoretical basis for 3D space charge distribution calculations and the optimization of insulation packaging design in IGBT modules.