This article proposes a new electrode technology for reversed S (DS) type press packing module

which integrates electrical and thermal conductivity

elasticity

and low inductance. It combines the elasticity of disc spring components with the electrical conductivity

thermal conductivity

and low inductance of convex rigid electrodes. Based on the new DS type electrode

a basic structural form

simulation model

manufacturing process

and material selection of a low-stress elastic press-pack power module are designed. A detailed introduction is given to the model and the multi-physics simulation

manufacturing process

voltage resistance and static performance testing of a new single-chip module designed based on 4500V silicon-based IGBT and fast recovery diode (FRD) chips. Preliminary test results show that the single-chip module based on DS type elastic electrodes has good comprehensive press-pack performance and can provide a basic electrode model for the packaging design of 4500V/3000A and higher rated modules in the future.