Key Technological Challenges and Collaborative Innovation Pathways of China's Integrated Circuits

Xiong Xiaoming; Zhan Ruidian; Rao Bo; Zheng Xin; Liu Yuan

doi:10.12052/gdutxb.250119

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Key Technological Challenges and Collaborative Innovation Pathways of China's Integrated Circuits

更新时间：2026-05-27

- Key Technological Challenges and Collaborative Innovation Pathways of China's Integrated Circuits
- Vol. 42, Issue 6, Pages: 1-11(2025)
- 作者机构：
  
  1. 广东工业大学集成电路学院,广东,广州,510006
  2. 牛芯半导体(深圳) 有限公司,广东,深圳,518000
- 作者简介：
- 基金信息：
- DOI：10.12052/gdutxb.250119
  CLC： TP332.1;TP319;TN402
- Published：2025
- 稿件说明：
移动端阅览
熊晓明, 詹瑞典, 饶博, 等. 我国集成电路关键技术挑战与协同创新路径[J]. 广东工业大学学报, 2025, 42(6): 1–11.

Xiong Xiaoming, Zhan Ruidian, Rao Bo, et al. Key Technological Challenges and Collaborative Innovation Pathways of China's Integrated Circuits[J]. 2025, 42(6): 1-11.
熊晓明, 詹瑞典, 饶博, 等. 我国集成电路关键技术挑战与协同创新路径[J]. 广东工业大学学报, 2025, 42(6): 1–11. DOI： 10.12052/gdutxb.250119

Xiong Xiaoming, Zhan Ruidian, Rao Bo, et al. Key Technological Challenges and Collaborative Innovation Pathways of China's Integrated Circuits[J]. 2025, 42(6): 1-11. DOI： 10.12052/gdutxb.250119.

摘要

在全球科技博弈加剧、关键技术受限的背景下，集成电路产业已成为国家战略安全和科技自主的核心领域。本文系统梳理了我国集成电路产业链发展现状，聚焦设计、制造、电子设计自动化(Electronic Design Automation，EDA)、封装等关键环节的技术瓶颈与“卡脖子”问题。在分析美国主导的技术封锁及全球产业重构趋势基础上，指出我国面临的外部压力与内生短板并存的复杂局势。结合在人工智能(Artificial Intelligence，AI)硬件加速器、软硬件协同设计、器件建模与仿真、AI辅助EDA等方面的最新研究实践，本文提出一种协同创新驱动的技术突围路径，探索后摩尔时代的算力架构、系统封装和EDA协同设计方向。最后，建议加强“工艺—器件—架构—工具—系统”一体化战略布局，建立开放可控、自主完整的技术生态体系。本文为集成电路领域的技术创新与政策制定提供理论支持和实践参考。

Abstract

Against the backdrop of intensified global technological rivalry and restrictions on critical technologies

the Integrated Circuit (IC) industry has become central domain of national strategic security and technological self-reliance. This paper systematically reviews the development status of China's IC industry chain

focusing on key bottlenecks in design

manufacturing

Electronic Design Automation (EDA) tools

and advanced packaging. Based on an analysis of external pressures such as U.S.-led technology embargoes and internal structural weaknesses

the authors identify the dual challenges faced by the industry. Combined with the latest research practice in Artificial Intelligence (AI) hardware accelerators

hardware/software co-design

device modeling and simulation

and AI-assisted EDA

this paper proposes a technology breakthrough path driven by collaborative innovation

and explores new directions in computing architecture

system packaging

and EDA design under the post-Moore paradigm. This paper provides theoretical support and practical references for technological innovation and policy formulation in the integrated circuit field.

关键词

Keywords

references

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