State-of-the-art of Ultra-precision Grinding Technology for Hard and Brittle Materials

Xia Jiang-nan; Yan Qiu-sheng; Pan Ji-sheng; Luo Zi-yuan; Wang Tao

doi:10.12052/gdutxb.230151

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State-of-the-art of Ultra-precision Grinding Technology for Hard and Brittle Materials

更新时间：2026-05-27

- State-of-the-art of Ultra-precision Grinding Technology for Hard and Brittle Materials
- Vol. 40, Issue 6, Pages: 32-43(2023)
- 作者机构：
  
  广东工业大学机电工程学院,广东,广州,510006
- 作者简介：
- 基金信息：
- DOI：10.12052/gdutxb.230151
  CLC： TG580
- Online First：25 November 2023，
  
  Published：2023
- 稿件说明：
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夏江南, 阎秋生, 潘继生, 雒梓源, 汪涛. 硬脆材料超精密磨削技术研究进展综述[J]. 广东工业大学学报, 2023, 40(6): 32-43.

Xia Jiang-nan, Yan Qiu-sheng, Pan Ji-sheng, et al. State-of-the-art of Ultra-precision Grinding Technology for Hard and Brittle Materials[J]. 2023, 40(6): 32-43.
夏江南, 阎秋生, 潘继生, 雒梓源, 汪涛. 硬脆材料超精密磨削技术研究进展综述[J]. 广东工业大学学报, 2023, 40(6): 32-43. DOI： 10.12052/gdutxb.230151.

Xia Jiang-nan, Yan Qiu-sheng, Pan Ji-sheng, et al. State-of-the-art of Ultra-precision Grinding Technology for Hard and Brittle Materials[J]. 2023, 40(6): 32-43. DOI： 10.12052/gdutxb.230151.

摘要

硬脆材料因其优异的物理与化学性质广泛应用于5G通讯、航空航天、电子电力等领域，高效率的超精密磨削技术是其加工流程中的重要一环。为了提高硬脆材料加工质量，需要对超精密磨削技术进行系统化的深入研究。本文从超精密磨削装备设计优化的角度出发，对自旋转磨削、双面磨削和磨抛一体化3种磨削方法的原理与机床设备进行了详细说明，介绍了超硬磨粒砂轮的制备、砂轮磨损检测与分析、砂轮修整技术的研究进展；从压痕/划痕实验、纳米磨削实验、模拟仿真分析3个角度对硬脆材料的磨削机理进行了深入探索；进一步总结了硬脆材料表面粗糙度及表面形貌、亚表面损伤、面形精度的控制方法。分析了硬脆材料超精密磨削的重点研究方向与发展趋势，为后续硬脆材料超精密磨削技术的研究提供了指导。

Abstract

Hard and brittle materials are extensively utilized in various fields

such as 5G communication

aerospace

and electronic power

owing to their exceptional physical and chemical properties. High-efficiency ultra-precision grinding technology plays a crucial role in their processing. Conducting systematic and thorough research on ultra-precision grinding technology is essential to enhance the processing quality of these materials. A detailed description is presented for three grinding methods: self-rotating grinding

double-sided grinding

and grinding-polishing integration

from the perspective of designing and optimizing ultra-precision grinding equipment. Furthermore

research progress is introduced on the preparation

wear detection

and dressing of super-hard abrasive grinding wheels. A thorough analysis is also provided of the grinding mechanism of hard and brittle materials

considering aspects such as indentation and scratch

nano-grinding

and simulation analysis. The control methods for surface roughness

surface morphology

subsurface damage

and surface shape accuracy of hard and brittle materials are also summarized.

关键词

Keywords

references

SU Y J, YANG M L, ZHU W L, et al . Development of key technologies for intelligent research and development of new materials [J ] . Strategic Study of CAE, 2023, 25(3): 161-169.

ESWARAPPA P S, POLLOCK T M, RAABE D, et al . Materials for extreme environments [J ] . Nature Reviews Materials, 2023, 8(2): 81-88.

WANG L R, SHI P. Development of low-melting optical glass for precision molding [J]. Glass Enamel, 2022, 50(7): 1-13.

WANG Y X. Development and applications of optical glasses [J]. Journal of Applied Optics, 2005(5): 61-66.

GUPTA C, PASAYAT S S. Vertical GaN and vertical Ga 2 O 3 power transistors: status and challenges [J ] . Physica Status Solidi (A), 2022, 219(7): 2100659.

MANE S. Semiconductor technologies [J]. International Journal of All Research Education and Scientific Methods, 2022, 10: 76-82.

LAKHDAR Y, TUCK C, BINNER J, et al . Additive manufacturing of advanced ceramic materials [J ] . Progress in Materials Science, 2021, 116: 100736.

PAN J S, YAN Q S, LU J B, et al . Cluster magnetorheological effect plane polishing technology [J ] . Journal of Mechanical Engineering, 2014, 50(1): 205-212.

BRINKSMEIER E, MUTLUGÜNES Y, KLOCKE F, et al . Ultra-precision grinding [J ] . CIRP Annals, 2010, 59(2): 652-671.

WANG S, ZHAO Q L, WANG S, et al . Research progress on precision and ultra-precision grinding mechanism and key technology on sapphire optical elements with complex surface [J ] . Aeronautical Manufacturing Technology, 2022, 65(9): 69-80.

GUO X Y, XU Y C, CAO J F, et al . Laser dressing technology for micro-grooves on the surface of metal-bonded diamond wheels [J ] . Diamond Abrasives Engineering, 2022, 42(3): 364-372.

CHEN Z, CHEN C H, LIU Y B, et al . Grinding YG8 cemented carbide with resin bond grinding wheels made of diamond agglomerate abrasive [J ] . Diamond Abrasives Engineering, 2020, 40(6): 25-30.

DING Y L, MIAO W P, LUO M D, et al . Influence of structure of vitrified bond diamond grinding wheel on its performance [J ] . Diamond Abrasives Engineering, 2020, 40(4): 19-23.

ZHAO B, DING W, XIAO G, et al . Effects of open pores on grinding performance of porous metal-bonded aggregated cBN wheels during grinding Ti–6Al–4V alloys [J ] . Ceramics International, 2021, 47(22): 31311-31318.

ZHANG C, QU S, XI W, et al . Preparation of a novel vitrified bond CBN grinding wheel and study on the grinding performance [J ] . Ceramics International, 2022, 48(11): 15565-15575.

郭东明, 康仁科. 硅片的超精密磨削理论与技术[M]. 北京: 电子工业出版社, 2019.

TAO H, LIU Y, ZHAO D, et al . Prediction and measurement for grinding force in wafer self-rotational grinding [J ] . International Journal of Mechanical Sciences, 2023, 258: 108530.

TAO H, LIU Y, ZHAO D, et al . The material removal and surface generation mechanism in ultra-precision gri nding of silicon wafers [J ] . International Journal of Mechanical Sciences, 2022, 222: 107240.

NIKITINA I P, POLYAKOV A N. Improving thermal characteristics of double-sided face grinding machines[C]//Proceedings of the 9th International Conference on Industrial Engineering. Cham: Springer Nature Switzerland, 2023: 112-121.

NIKITINA I P, POLYAKOV A N. Experimental study of double-sided face grinding machine tool [J]. Journal of physics. Conference series, 2019, 1399(4): 44026.

WEN H L, LU J, LI C, et al . Integrated processing of grinding and polishing for large-size single crystal diamond [J ] . Journal of Synthetic Crystals, 2022, 51(5): 941-947.

GUO B, ZHANG Q H, GUO Z F, et al . Research on high-efficiency precision grinding of structured surfaces basedon structured grinding wheels [J ] . Aeronautical Manufacturing Technology, 2022, 65(9): 50-59.

XUAN C, WANG C C, BAI F H, et al . Vitrified bond diamond grinding wheel based on hollow corundum microspheres [J ] . Diamond Abrasives Engineering, 2022, 42(4): 442-448.

SONG Y T, HOU Y G, L I W F, et al . Effect of Ni-P on properties and structure of ceramic-metal bond [J ] . Journal of Synthetic Crystals, 2019, 48(11): 2130-2134.

张钰奇. 磨粒有序排布金刚石砂轮研制及其性能分析[D]. 焦作: 河南理工大学, 2020.

TENG S G, ZHANG S H, ZHANG X H, et al . Experimental study on grinding SiC ceramics with different structured diamond wheels [J ] . Tool Engineering, 2021, 55(8): 38-43.

WU M, GUO B, ZHAO Q, et al . High efficiency precision grinding of micro-structured SiC surface using laser micro-structured coarse-grain diamond grinding wheel [J ] . International Journal of Precision Engineering and Manufacturing-Green Technology, 2019, 6(3): 577-586.

GUO B, WU M, ZHAO Q, et al . Improvement of precision grinding performance of CVD diamond wheels by micro-structured surfaces [J ] . Ceramics International, 2018, 44(14): 17333-17339.

MU D Q, ZHANG F K, ZHAO S Y, et al . Research on test of grinding wheel wear based on differential pressure technology [J ] . Machine Tool Hydraulics, 2019, 47(2): 79-81.

SHI J, DING N. On-ine detection of the state of grinding wheel wear based on acoustic emission technique [J]. Journal of Changchun University, 2013, 23(8): 931-936.

LUO B, YAN Q S, PAN J S, et al . Influences of processing parameters on metal-bonded diamond wheel wear when grinding a sapphire wafer [J ] . Diamond and Related Materials, 2021, 113: 108275.

ZHANG H X, YAN Q S, CHEN H Y, Experimental study of resin-bonded diamond wheel wear in grinding of sapphire[J]. Mechanical Electrical Engineering Technology, 2020, 49(1) : 1-4.

JEON S, ZOLFAGHARI A, LEE C. Dicing wheel wear monitoring technique utilizing edge diffraction effect [J]. Measurement, 2018, 121: 139-143.

汪旋. 基于磨削温度的砂轮磨损状态在线监测技术研究[D]. 泉州: 华侨大学, 2020.

CHEN B, GUO B, ZHAO Q. Online monitoring of truing arc-shaped diamond wheel by acoustic emission signal [J]. Proceedings of the Institution of Mechanical Engineers, Part B:Journal of Engineering Manufacture, 2018, 232(8): 1484-1490.

MU D Q, ZHENG J T, SI S M, et al . Research on wear measurement of grinding wheel based on laser triangulation [J ] . Journal of Changchun University of Technol ogy, 2021, 42(3): 200-204.

GUO B, ZHAO Q. Ultra-precision machining of hard and brittle materials with coarse-grained grinding wheels[C]//Zhang J, Guo B, Zhang J. Simulation and experiments of material-oriented ultra-precision machining. Singapore: Springer Singapore, 2019: 201-236.

JIAO F, LI C L, NIU Y, et al . Review and prospect of grinding wheel dressing technique [J ] . China Mechanical Engineering, 2021, 32(20): 2435-2448.

王楠. 磨削机床砂轮修整专利技术分析[J]. 金属加工(冷加工) , 2017(19): 22-23.

MUKHOPADHYAY M, KUNDU P K, CHATTERJEE S, et al . Impact of dressing infeed on SiC wheel for grinding Ti-6Al-4V [J ] . Materials and Manufacturing Processes, 2019, 34(1): 54-60.

LI M, DING W, LI B, et al . Morphological evolution and grinding performance of vitrified bonded microcrystal alumina abrasive wheel dressed with a single-grit diamond [J ] . Ceramics International, 2019, 45(16): 19669-19678.

ZHOU L, WEI Q, ZHENG N, et al . Dressing technology of arc diamond wheel by roll abrading in aspheric parallel grinding [J ] . The International Journal of Adv anced Manufacturing Technology, 2019, 105(5-6): 2699-2706.

XU L M, FAN F, ZHANG Z, et al . Fast on-machine profile characterization for grinding wheels and error compensation of wheel dressing [J ] . Precision Engineering, 2019, 55: 417-425.

WU Y H, GAO L F, LI S H, et al . Research of precision dressing process for large diameter convex arc diamond grinding wheel [J ] . Modern Manufacturing Engineering, 2022(7): 97-103.

LIANG Z Q, WU L F, ZHOU T F, et al . Experimental study on diamond wheel V-tip truing using a tangential grinding truing method [J ] . Journal of Mechanical Engineering, 2018, 54(3): 196-202.

WANG S, ZHAO Q, GUO B. Wear characteristics of electroplated diamond dressing wheels used for on-machine precision truing of arc-shaped diamond wheels [J]. Diamond and Related Materials, 2022, 129: 109372.

GUO B, MENG Q, LI S, et al . Pulse laser precision truing of the V-shaped coarse-grained electroplating CBN grinding wheel [J ] . Materials Design, 2022, 217: 110650.

YANG Z, SUN W, HE D, et al . Effect of laser-assiste d ultrasonic vibration dressing parameters of a cubic boron nitride grinding wheel on grinding force, surface quality, and particle morphology [J ] . Reviews on Advanced Materials Science, 2021, 60(1): 691-701.

WU Q P, OUYANG Z Y, YANG H, et al . Influence of carbon nanotubes on electrolytic dressing grinding performance of a multi-layer brazed coarse-grained diamond wheel [J ] . Journal of Mechanical Engineering, 2020, 56(7): 231-239.

SHAN Z Z, ZHOU C, CHEN G Y, et al . Experimental study on electro-discharge dressing of super-abrasive grinding wheel using different dielectric [J ] . Diamond Abrasives Engineering, 2020, 40(5): 79-84.

BIFANO T G, DOW T A, SCATTERGOOD R O. Ductile-regime grinding: a new technology for machining brittle materials [J]. Journal of Engineering for Industry-Transactions of the ASME, 1991, 113(2): 184-189.

GE M, ZHU H, HUANG C, et al . Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments [J ] . Materials Science in Semiconductor Processing, 2018, 74: 261-266.

潘继生. 单晶SiC基片超精密磨粒加工机理研究[D]. 广州: 广东工业大学, 2015.

DUAN N, HUANG S G, YU Y Q, et al . The material removal mechanism of monocrystal SiC scratching by single diamond grit with different tip radius [J ] . Journal of Mechanical Engineering, 2017, 53(15): 171-180.

GUO J J, MADHAV R K, HIRATA A, et al . Sample size induced brittle-to-ductile transition of single-crystal aluminum nitride [J ] . Acta Materialia, 2015, 88: 252-259.

MENG B, ZHANG Y, ZHANG F. Material removal mechanism of 6H-SiC studied by nano-scratching with Berkovich indenter [J]. Applied Physics A, 2016, 122(3): 247.

YAN Q S, CHEN S K, PAN J S, et al . Surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding [J ] . Materials Research Innovations, 2014, 18(sup2): S2-S742.

WU K, LU X M, MEHMOOD A, et al, Fixed abrasive based self-rotation grinding for single crystal sapphire[J]. China Mechanical Engineering, 2021, 32(16) : 2002-2007.

ZHOU Y G, LI H Y, TIAN C C, et al . Study on grinding mechanism and surface quality of SiC ceramics [J ] . Modular Machine Tool Automatic Manufacturing Technique, 2022(3): 156-160.

GAO S, WU Y, KANG R, et al . Nanogrinding induced surface and deformation mechanism of single crystal β -Ga 2 O 3 [J ] . Materials Science in Semiconductor Processing, 2018, 79: 165-170.

LI C, ZHANG F, MENG B, et al . Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics [J ] . Ceramics International, 2017, 43(3): 2981-2993.

CHEN Y, HU Z, YU Y, et al . Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire [J ] . Materials Science in Semiconductor Processing, 2022, 142: 106470.

吴焕杰. 金刚石砂轮磨削碳化硅陶瓷的有限元仿真与实验研究[D]. 沈阳: 沈阳工业大学, 2021.

JIANG P J. Three dimensional simulation and experiment of plane grinding temperature field based on temperature matching method[J]. Diamond Abrasives Engineering, 2020, 40(5) : 96-101.

XIAO G, TO S, ZHANG G. The mechanism of ductile deformation in ductile regime machining of 6H SiC [J]. Computational Materials Science, 2015, 98: 178-188.

ZHANG C, DONG Z, ZHANG S, et al . The deformation mechanism of gallium-faces and nitrogen-faces gallium nitride during nanogrinding [J ] . International Journal of Mechanical Sciences, 2022, 214: 106888.

邱鸿晶. 基于分子动力学的4H-SiC延性域超精密磨削机理研究[D]. 长沙: 湖南大学, 2020.

YAO S L, ZHENG J T, MU D Q. Research on surface quality of ultrasonic vibration assisted grinding [J]. China Instrumentation, 2021(2): 33-37.

SUN G, SHI F, ZHANG B, et al . Surface generation mechanism of the rotary ultrasonic vibration–assisted grinding of aspheric glass ceramics [J ] . The International Journal of Advanced Manufacturing Technology, 2023, 124(7-8): 2579-2595.

HANG Y, SHENG W, QINGLIANG Z, et al. Ultra-precision grinding and accuracy measurement of the hard-brittle thin-walled tubular optics [C]// 10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing and Metrology Technologies. Chengdu: SPIE, 2021: 120710H.

PAN J, ZHANG X, YAN Q, et al . Experimental study of surface performance of monocrystalline 6H-SiC substrates in plane grinding with a metal-bonded diamond wheel [J ] . The Internati onal Journal of Advanced Manufacturing Technology, 2017, 89(1-4): 619-627.

WANG Z G, LIU J X, YIN J, et al . Surface quality of ultra-precision grinding of silicon with fine diamond grinding wheels [J ] . China Mechanical Engineering, 2023, 34(2): 245-251.

HUO F W, KANG R K, LI Z, et al . Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers [J ] . International Journal of Machine Tools and Manufacture, 2013, 66: 54-65.

WANG J B, ZHOU L B. Study progress of single crystal functional materials by rotary infeed surface grinding [J]. Journal of Synthetic Crystals, 2018, 47(7): 1388-1395.

TIAN H L, HAN T, YAN S H, et al . Study on formation mechanism and suppression of subsurface damage during nano-grinding of monocrystalline silicon [J ] . Manufacturing Technology Machine Tool, 2023(3): 24-30.

宋健. 单晶氮化镓的磨削特性研究及其分子动力学仿真[D]. 盐城: 盐城工学院, 2023.

DAI J B, SU H H, FU Y C, et al . Effect of grinding speed on mechining damage of silicon carbide ceramics [J ] . Journal of Mechanical Engineering, 2022, 58 (21): 316-330.

GAO S, GENG Z C, WU Y Q, et al . Surface integrity of quartz glass induced by ultra-precision grinding [J ] . Journal of Mechanical Engineering, 2019, 55(5): 186-195.

王丽娟. 蓝宝石衬底的双面行星磨削加工机理研究[D]. 泉州: 华侨大学, 2019.

LIU Z Y, CHANG Q Q, CUI J. Optimum method of TTV in wafer grinding [J]. Equipment for Electronic Products Manufacturing, 2019, 48(5): 7-9.

田业冰. 大尺寸硅片磨削平整化理论与工艺技术的研究[D]. 大连: 大连理工大学, 2007.

GAO H, TIAN Y B, JIA Z Y, et al . Investigation on the dressing shape of vacuum chuck in wafer rotation grinding [J ] . Key Engineering Materials, 2005, 291-292: 171-176.

姚卫华. 晶圆留边磨削面形仿真与控制[D]. 大连: 大连理工大学, 2022.

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