Research and Application Progress of Composite Polyimide with Low Dielectric Properties

Yu Wen-tao; Song Jian-yuan; Fang Ji-yong; Liu Yi-dong; Liu Cun-sheng; Min Yong-gang

doi:10.12052/gdutxb.210122

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Research and Application Progress of Composite Polyimide with Low Dielectric Properties

更新时间：2026-05-27

- Research and Application Progress of Composite Polyimide with Low Dielectric Properties
- Vol. 40, Issue 1, Pages: 122-129(2023)
- 作者机构：
  
  1. 广东工业大学材料与能源学院,广东,广州,510006
  2. 深圳崇达多层线路板有限公司,广东,深圳,518052
- 作者简介：
- 基金信息：
- DOI：10.12052/gdutxb.210122
  CLC： TQ323.7;TB34
- Online First：25 January 2023，
  
  Published：2023
- 稿件说明：
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余文涛, 宋建远, 方基永, 刘屹东, 刘存生, 闵永刚. 复合型低介电常数聚酰亚胺复合材料研究进展[J]. 广东工业大学学报, 2023, 40(1): 122-129.

Yu Wen-tao, Song Jian-yuan, Fang Ji-yong, et al. Research and Application Progress of Composite Polyimide with Low Dielectric Properties[J]. 2023, 40(1): 122-129.
余文涛, 宋建远, 方基永, 刘屹东, 刘存生, 闵永刚. 复合型低介电常数聚酰亚胺复合材料研究进展[J]. 广东工业大学学报, 2023, 40(1): 122-129. DOI： 10.12052/gdutxb.210122.

Yu Wen-tao, Song Jian-yuan, Fang Ji-yong, et al. Research and Application Progress of Composite Polyimide with Low Dielectric Properties[J]. 2023, 40(1): 122-129. DOI： 10.12052/gdutxb.210122.

摘要

聚酰亚胺具有优异的力学性能及耐热性，一直是微电子产业的重要电介质材料之一。近年来，随着微电子行业的发展和5G通讯技术的兴起，从能耗要求到信号接收等方面都对降低聚酰亚胺的介电常数和介电损耗提出更高的要求。如何在保留聚酰亚胺优异性能的同时尽可能降低其介电常数与损耗是目前亟需解决的问题。本文综述了近年来多孔聚酰亚胺和聚合物填料、无机纳米填料复合改性聚酰亚胺等复合型低介电聚酰亚胺的研究及应用进展，探讨了如何在降低聚酰亚胺介电常数的同时保持其他性能，并对其发展进行了展望，为新型复合型低介电聚酰亚胺材料的设计与制备提供新思路。

Abstract

With excellent mechanical properties and heat resistance

polyimide has been one of the important dielectric materials in microelectronics industry. In recent years

with the rapid development of microelectronics industry and the rise of 5G communication technology

higher requirements are put forward for the dielectric constant and dielectric loss reduction of polyimide in terms of energy consumption requirements and signal reception. How to reduce as much as possible the dielectric constant and dielectric loss and retain the excellent properties of polyimide at the same time is an urgent problem to solve at present. The research and application progress of porous polyimides

polymers filler and inorganic nano filler composite modified polyimides and other composite low dielectric polyimides emerging in recent years are reviewed. How to reduce the dielectric constant of polyimides while maintaining other properties is discussed

and its development is prospected. It will provide a new idea for the design and preparation of new composite low dielectric polyimide materials.

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Keywords

references

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