Research and Optimization Design of High-speed PCBBased on Signal Integrity

Yuan Wei-qun; Song Jian-yuan; Chen Shi-rong

doi:10.12052/gdutxb.190095

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Research and Optimization Design of High-speed PCBBased on Signal Integrity

更新时间：2026-05-27

- Research and Optimization Design of High-speed PCBBased on Signal Integrity
- Vol. 36, Issue 6, Pages: 74-79(2019)
- 作者机构：
  
  1. 崇达技术股份有限公司,广东,深圳,518132
  2. 广东工业大学轻工化工学院,广东,广州,510090
- 作者简介：
- 基金信息：
- DOI：10.12052/gdutxb.190095
  CLC： TN41;TN911
- Online First：28 November 2019，
  
  Published：2019
- 稿件说明：
移动端阅览
袁为群, 宋建远, 陈世荣. 基于信号完整性的高速PCB优化设计与研究[J]. 广东工业大学学报, 2019, 36(6): 74-79.

Yuan Wei-qun, Song Jian-yuan, Chen Shi-rong. Research and Optimization Design of High-speed PCBBased on Signal Integrity[J]. 2019, 36(6): 74-79.
袁为群, 宋建远, 陈世荣. 基于信号完整性的高速PCB优化设计与研究[J]. 广东工业大学学报, 2019, 36(6): 74-79. DOI： 10.12052/gdutxb.190095.

Yuan Wei-qun, Song Jian-yuan, Chen Shi-rong. Research and Optimization Design of High-speed PCBBased on Signal Integrity[J]. 2019, 36(6): 74-79. DOI： 10.12052/gdutxb.190095.

摘要

印制电路板(Printed Circuit Board，PCB)设计者因缺少PCB制造经验而难以系统、全面和创造性地考虑高速电路的信号完整性问题

本文运用信号完整性相关理论知识全面分析和解决高速PCB设计过程中遇到的问题. 以高速PCB的设计和制造为例

利用信号完整性分析方法将地层铜桥、差分线和导通孔设计与高速电路的特征和实际制造工艺相结合

创造性地把外层差分微带线通过盲孔转移到内层带状线

找到优化设计的解决方案. 实例显示，把信号完整性分析与高速PCB可制造性相结合，能够有效地解决高速PCB的信号失真问题

一定程度上优化了高速电路的设计及缩短了产品的开发周期.

Abstract

Due to the lack of the PCB (Printed Circuit Board) manufacturing experience

it is difficult for designers to consider the problem of signal integrity for high-speed PCB systematically

comprehensively and innovatively. The theory of signal integrity is used to comprehensively analyze the contradictions encountered in the design process

so as to solve the contradictory problems more effectively. Taking the problems encountered in PCB design and fabrication as examples

the method of signal integrity analysis is used to combine the design of copper bridge

differential trace and via holes with the feature of high-speed circuit and manufacturing process

and optimal solution is obtained by the extension innovation of transferring the differential traces from external layer micro-strip to the internal layer strip-line by blind holes. From the examples

it can be found that the signal distortion problem of high-speed PCB can be effectively solved by combining signal integrity analysis and design of manufacturing

and thus the high-speed circuit design and product development cycle is greatly optimized.

关键词

Keywords

references

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莫剑冬, 谢永超, 王建甫. 过孔特性阻抗分析及其对信号质量的影响[J]. 机电元件, 2015, 35(2): 32-51.

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WANG H F, LI Z D, QIAO S X. Impedance control of vias and its impact on signal integrity [J]. Printed Circuit Information, 2012, 20(4): 74-78.

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