Simulation and Verification of Warpage Deformation of PBGA Package Reflow Soldering

Wang Xiao-feng; He Xiao-qi; Yao Bin

doi:10.12052/gdutxb.190047

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Simulation and Verification of Warpage Deformation of PBGA Package Reflow Soldering

更新时间：2026-05-27

- Simulation and Verification of Warpage Deformation of PBGA Package Reflow Soldering
- Vol. 37, Issue 2, Pages: 94-101(2020)
- 作者机构：
  
  1. 广东工业大学材料与能源学院,广东,广州,510006
  2. 工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术重点实验室,广东,广州,510610
- 作者简介：
- 基金信息：
- DOI：10.12052/gdutxb.190047
  CLC： TN389
- Online First：10 March 2020，
  
  Published：2020
- 稿件说明：
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王晓锋, 何小琦, 尧彬. PBGA封装回流焊翘曲变形仿真与验证[J]. 广东工业大学学报, 2020, 37(2): 94-101.

Wang Xiao-feng, He Xiao-qi, Yao Bin. Simulation and Verification of Warpage Deformation of PBGA Package Reflow Soldering[J]. 2020, 37(2): 94-101.
王晓锋, 何小琦, 尧彬. PBGA封装回流焊翘曲变形仿真与验证[J]. 广东工业大学学报, 2020, 37(2): 94-101. DOI： 10.12052/gdutxb.190047.

Wang Xiao-feng, He Xiao-qi, Yao Bin. Simulation and Verification of Warpage Deformation of PBGA Package Reflow Soldering[J]. 2020, 37(2): 94-101. DOI： 10.12052/gdutxb.190047.

摘要

回流焊温变过程中

由于不同材料热膨胀系数(Coefficient of Thermal Expansion

CTE)的不匹配

塑料焊球阵列(plastic ball grid array

PBGA)封装会发生翘曲变形现象。本文采用有限元法对PBGA封装的翘曲变形及应力应变进行仿真分析

并用阴影云纹法对翘曲变形的模拟分析结果进行测试验证。结果表明: PBGA封装翘曲值的模拟值与实测值非常接近

分别为35.9 μm和36 μm; 模拟回流焊过程中

翘曲值的模拟值与实测值的变化趋势具有一致性。回流焊过程中

PBGA封装的热应力应变最大值都在基板靠近粘接层的位置

该位置是PBGA封装出现热可靠性问题的最大风险点。PBGA封装边角处的翘曲量最大

因而边角处的焊点也最容易出现开路、虚焊等装联缺陷。

Abstract

During the temperature change of reflow soldering

warpage deformation occurs in the plastic ball grid array package due to the mismatch of thermal expansion coefficients of different materials. A finite element method is used to simulate the warpage deformation behavior and stress strain of PBGA package

and the simulation results of warpage deformation are tested by shadow moiré method. The results show that the simulated values of the PBGA package warpage are very close to the measured values

which are respectively 35.9 μm and 36 μm. During the simulated reflow

the measured values of the warpage are consistent with the simulated values. During the reflow

the maximum thermal stress strain of the PBGA package is at the position of the substrate near the bonding layer

which is the biggest risk point for the thermal reliability of the PBGA package. The amount of warpage at the corners of the PBGA package is the largest

so the solder joints at the corners are also most prone to open-circuit

solder joint and other assembly defects.

关键词

Keywords

references

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