Epoxy resin (EP)

as a resin material with excellent insulation performance

has been widely applied in fields such as electronics

coatings

ships etc. However

epoxy resins generally have poor thermal conductivity

which limits their application in the field of new generation of electronic packaging. To address the key issues mentioned above

the BN@Fe3O4 particles with positive out-of-plane thermal conductivity were successfully prepared in this study

having a core-shell structure with rough surfaces as well. As a thermal conductive powder

the disadvantage of hexagonal boron nitride being easily agglomerated in resin has been improved. By applying an external magnetic field

three-dimensional thermal conduction pathways were constructed in the matrix. The physical and chemical properties of the BN@Fe3O4 powder and its composite materials were analysed and tested. The experiment indicates that the thermal conductive magnetic powder BN@Fe3O4 had been successfully prepared. When the filling amount of BN@Fe3O4 reached 27.5 vol%

the out-of-plane thermal conductivity of the composite material was 1.758 W m−1 K−1

which was 982.12% that of pure EP. At this point

the mechanical behaviour and insulation performance of EP composite materials can be effectively guaranteed at the same order of magnitude as pure EP performance.