A new on-site measurement technology on silver-plating thickness of contact finger for high-tension isolating switch

LIU Chun; XIE Yi; CHEN Jun-jun; CHEN Hong-dong

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A new on-site measurement technology on silver-plating thickness of contact finger for high-tension isolating switch

更新时间：2025-11-18

- A new on-site measurement technology on silver-plating thickness of contact finger for high-tension isolating switch
- Vol. 30, Issue 5, Pages: 14-16(2010)
- 作者机构：
  
  湖南省电力公司试验研究院
- 作者简介：
- 基金信息：
- DOI：
  CLC： TM564
- Published：2010
- 稿件说明：
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[1]刘纯,谢亿,陈军君,陈红冬.高压隔离开关触指镀银层现场测厚技术开发[J].湖南电力,2010,30(05):14-16.

LIU Chun, XIE Yi, CHEN Jun-jun, et al. A new on-site measurement technology on silver-plating thickness of contact finger for high-tension isolating switch[J]. 2010, 30(5): 14-16.
[1]刘纯,谢亿,陈军君,陈红冬.高压隔离开关触指镀银层现场测厚技术开发[J].湖南电力,2010,30(05):14-16. DOI：

LIU Chun, XIE Yi, CHEN Jun-jun, et al. A new on-site measurement technology on silver-plating thickness of contact finger for high-tension isolating switch[J]. 2010, 30(5): 14-16. DOI：

摘要

高压隔离开关触指镀银层的厚度是影响其电接触性和可靠性的重要因素。利用手持式XRF合金分析仪开发了一种针对高压隔离开关触指镀银层的现场测厚技术

测量方法简单

结果准确

具有推广价值。

Abstract

The silver-plating thickness of contact finger for high-tension isolating switch is a significant element to influence its electric contact and reliability.A new on-site measurement technology on silver-plating thickness of contact finger for high-tension isolating switch is developed with the help of the handheld XRF analyser.The measuring method is simple

accurate and recommendable.

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