Dynamic response of elliptical inclusion and crack near interface under vertically incident SH-wave from above

YANG Zai-lin; XU Hua-nan; HEI Bao-ping

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Dynamic response of elliptical inclusion and crack near interface under vertically incident SH-wave from above

更新时间：2026-06-25

- Dynamic response of elliptical inclusion and crack near interface under vertically incident SH-wave from above
- Vol. 34, Issue 8, (2013)
- 作者机构：
  
  哈尔滨工程大学航天与建筑工程学院,哈尔滨,150001
- 作者简介：
- 基金信息：
- DOI：
  CLC： TB115
- Online First：13 August 2013，
  
  Published：2013
- 稿件说明：
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YANG Zai-lin, XU Hua-nan, HEI Bao-ping. Dynamic response of elliptical inclusion and crack near interface under vertically incident SH-wave from above[J]. 2013, 34(8).
DOI：

YANG Zai-lin, XU Hua-nan, HEI Bao-ping. Dynamic response of elliptical inclusion and crack near interface under vertically incident SH-wave from above[J]. 2013, 34(8). DOI：

摘要

采用Green函数、保角映射等方法分析SH波上方垂直入射时弹性半空间中椭圆形弹性夹杂与任意方位裂纹的相互作用。首先，求解含椭圆形弹性夹杂的弹性半空间内任意一点承受时间谐和出平面线源荷载作用时的位移基本解，即Green函数，再结合裂纹切割法构造裂纹，得到SH波上方垂直入射时椭圆夹杂和裂纹同时存在条件下的位移场与应力场。作为算例，给出大量的数值结果，探讨不同参数情况下弹性夹杂周边动应力集中系数（DSCF）、地表位移及裂纹尖端动应力强度因子（DSIF）的分布规律，结果表明不同参数的变化会对三者的分布带来一定的影响。

Abstract

Green’s function method and "conformal mapping" technology are used to analyze interaction of an elliptical elastic inclusion and a crack at arbitrary position under incident SH-waves from above. The fundamental solution to the displacement field for elastic half space containing an elliptical inclusion while bearing a time harmonic out-plane line source load at any point was firstly constructed

namely the suitable Green’s function. Combined with “crack-division” technology

a beeline crack was then created to derive the displacement field and stress field of elastic half-space containing an elliptical elastic inclusion and a crack. Lastly

numerous numerical examples are given to discuss distribution regularities of dynamic stress concentration factor (DSCF) around the elliptical inclusion

the horizontal surface displacement and dynamic stress intensity factor (DSIF) at crack tip under different parameters

and the results demonstrate that variation of different parameters can bring certain effect on them.

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