The Effect of Semi-Solid Processing Technology on the Performance of Sn-Bi Alloy

Liu Yao; Li Feng

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The Effect of Semi-Solid Processing Technology on the Performance of Sn-Bi Alloy

更新时间：2026-05-27

- The Effect of Semi-Solid Processing Technology on the Performance of Sn-Bi Alloy
- Vol. 25, Issue 4, Pages: 24-27(2008)
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- Online First：01 March 2008，
  
  Published：2008
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刘尧, 李风. 半固态成形工艺对Sn-Bi合金性能的影响[J]. 广东工业大学学报, 2008, 25(4): 24-27.

Liu Yao, Li Feng. The Effect of Semi-Solid Processing Technology on the Performance of Sn-Bi Alloy[J]. 2008, 25(4): 24-27.
刘尧, 李风. 半固态成形工艺对Sn-Bi合金性能的影响[J]. 广东工业大学学报, 2008, 25(4): 24-27. DOI：

Liu Yao, Li Feng. The Effect of Semi-Solid Processing Technology on the Performance of Sn-Bi Alloy[J]. 2008, 25(4): 24-27. DOI：

摘要

采用机械搅拌技术制备锡铋合金半固态浆料

研究了搅拌温度、搅拌时间对锡铋半固态合金组织和力学性能的影响.试验结果表明:搅拌速度为320 r/min、搅拌时间为10 min、搅拌温度为145℃时的搅拌效果相对较好

得到了近球形的半固态锡铋合金金相组织

固相颗粒的尺寸较小

分布较均匀.半固态铸造挤压制备温度保险丝的抗拉强度和延伸率与一般普通铸造挤压法相比分别提高了23%和28%;半固态锡铋合金浸润性良好

可以达到温度保险丝的使用要求.

Abstract

Semisolid Sn-Bi alloy slurry can be obtained by mechnical stirring technology.On the basis of the condition tests of stirring speed and shear time

the microstructure and mechanics properties of semi-solid alloy were studied by optical microscopy and universal testing machine.Test results show that the optimal microstructure of semisolid Sn-Bi alloy can be obtained at shear time 10 min with fixed agitating rate 320 r/min

at the temperature of 145 ℃ or so

and the smaller and nearly rounded solid p...

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references

李元山,李德良. 无铅汽相焊接工艺研究[J]. 计算机工程与科学. 2008(02)

刘春忠,张伟,隋曼龄,尚建库. 共晶SnBi/Cu焊点界面处Bi的偏析[J]. 金属学报. 2005(08)

宋建丽,邱永生,游晓红,李天佑. 半固态ZnAl27合金组织形成机理研究[J]. 山西机械. 2003(01)

毛卫民编著.半固态金属成形技术[M]. 机械工业出版社, 2004

(日)长崎诚三,平林真编著,刘安生译.二元合金状态图集[M]. 冶金工业出版社, 2004

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