Study on the Causation of Having No Copper in the Holes of the Printed Circuit Board

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- Study on the Causation of Having No Copper in the Holes of the Printed Circuit Board
- Vol. 19, Issue 4, Pages: 85-89(2002)
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- Online First：07 November 2002，
  
  Published：2002
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陈世荣. 印刷电路板孔内无铜产生原因的研究[J]. 广东工业大学学报, 2002, 19(4): 85-89.

CHEN Shi-rong. Study on the Causation of Having No Copper in the Holes of the Printed Circuit Board[J]. 2002, 19(4): 85-89.
陈世荣. 印刷电路板孔内无铜产生原因的研究[J]. 广东工业大学学报, 2002, 19(4): 85-89. DOI：

CHEN Shi-rong. Study on the Causation of Having No Copper in the Holes of the Printed Circuit Board[J]. 2002, 19(4): 85-89. DOI：

孔内无铜是造成印刷电路板产品报废的原因之一

本文用切片显微方法

从生产工序研究孔内无钢产生的原因

根据生产流程提出一些改善措施

提高了产品合格率。

程良. 塑料电镀工艺技术[J]. 电镀与环保. 2001(05)

曾华梁等编.电镀工艺手册[M]. 机械工业出版社, 1997

[美]C·R·德雷珀编,冯昌鑫等译.印制电路和电子部件的生产[M]. 科学出版社, 1981

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